FDP3672 N-Channel PowerTrench® MOSFET 105 V, 41 A, 33 mΩ Features Applications • RDS(on) = 25 mΩ ( Typ.) @ VGS = 10 V, ID = 41 A • Consumer Appliances • QG(tot) = 28 nC ( Typ.
Device Marking FDP3672 Device FDP3672 Package TO-220 Reel Size Tube Tape Width N/A Quantity 50 units Electrical Characteristics TC = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Unit Off Characteristics B VDSS Drain to Source Breakdown Voltage IDSS Zero Gate Voltage Drain Current IGSS Gate to Source Leakage Current ID = 250µA, VGS = 0V 105 - - V - - 1 - - 250 µA VGS = ±20V - - ±100 nA VGS = VDS, ID = 250µA 2 - 4 V ID = 41A, VGS = 10V - 0
1.2 50 ID, DRAIN CURRENT (A) POWER DISSIPATION MULTIPLIER VGS = 10V 1.0 0.8 0.6 0.4 0.2 40 30 20 10 0 0 25 50 75 100 150 125 0 175 25 50 75 TC , CASE TEMPERATURE (oC) 100 125 150 175 TC, CASE TEMPERATURE (o C) Figure 1. Normalized Power Dissipation vs Ambient Temperature Figure 2. Maximum Continuous Drain Current vs Case Temperature 2 DUTY CYCLE - DESCENDING ORDER 0.5 0.2 0.1 0.05 0.02 0.01 ZθJC, NORMALIZED THERMAL IMPEDANCE 1 PDM 0.
200 200 ID, DRAIN CURRENT (A) IAS, AVALANCHE CURRENT (A) 10µs 100 100µs 10 OPERATION IN THIS AREA MAY BE LIMITED BY rDS(ON) 1ms 1 10ms SINGLE PULSE TJ = MAX RATED TC = 25oC STARTING TJ = 25oC 10 STARTING TJ = 150oC DC 1 0.1 1 10 VDS, DRAIN TO SOURCE VOLTAGE (V) 100 0.001 200 80 0.01 0.1 1 10 tAV, TIME IN AVALANCHE (ms) Figure 5. Forward Bias Safe Operating Area NOTE: Refer to Fairchild Application Notes AN7514 and AN7515 Figure 6.
1.2 1.2 NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE VGS = VDS, ID = 250µA NORMALIZED GATE THRESHOLD VOLTAGE 1.0 0.8 0.6 1.1 1.0 0.9 0.4 -80 -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE (o C) -80 200 Figure 11. Normalized Gate Threshold Voltage vs Junction Temperature -40 0 40 80 120 160 TJ , JUNCTION TEMPERATURE (o C) 200 Figure 12.
VDS BVDSS tP L VARY tP TO OBTAIN REQUIRED PEAK IAS + RG - VGS VDS IAS VDD VDD DUT tP 0V IAS 0 0.01Ω tAV Figure 15. Unclamped Energy Test Circuit Figure 16. Unclamped Energy Waveforms VDS VDD Qg(TOT) VDS L VGS + - VGS VGS = 10V Qgs2 VDD DUT VGS = 2V Ig(REF) 0 Qg(TH) Qgs Qgd Ig(REF) 0 Figure 17. Gate Charge Test Circuit Figure 18. Gate Charge Waveforms VDS tON tOFF td(ON) td(OFF) RL tr VDS 90% - VDD 10% 0 10% DUT 90% VGS VGS 0 Figure 19.
rev October 2002 LDRAIN DPLCAP 10 Dbody 7 5 DbodyMOD Dbreak 5 11 DbreakMOD Dplcap 10 5 DplcapMOD RLDRAIN RSLC1 51 RSLC2 5 51 Ebreak 11 7 17 18 105 Eds 14 8 5 8 1 Egs 13 8 6 8 1 Esg 6 10 6 8 1 Evthres 6 21 19 8 1 Evtemp 20 6 18 22 1 EVTHRES + 19 8 + LGATE GATE 1 Lgate 1 9 9.56e-9 Ldrain 2 5 1.0e-9 Lsource 3 7 4.45e-9 11 + 17 EBREAK 18 - 50 RDRAIN 6 8 ESG DBREAK ESLC - It 8 17 1 DRAIN 2 5 + .SUBCKT FDP3672 2 1 3 ; Ca 12 8 5.8e-10 Cb 15 14 6.8e-10 Cin 6 8 1.
REV October 2002 template FDP3672 n2,n1,n3 electrical n2,n1,n3 { var i iscl dp..model dbodymod = (isl=1.0e-11,nl=1.05,rs=3.7e-3,trs1=2.5e-3,trs2=1.0e-6,cjo=1.2e-9,m=0.58,tt=3.75e-8,xti=4.0) dp..model dbreakmod = (rs=15,trs1=4.0e-3,trs2=-5.0e-6) dp..model dplcapmod = (cjo=3.8e-10,isl=10.0e-30,nl=10,m=0.60) m..model mmedmod = (type=_n,vto=3.6,kp=3,is=1e-40, tox=1) m..model mstrongmod = (type=_n,vto=4.3,kp=59,is=1e-30, tox=1) m..model mweakmod = (type=_n,vto=3.09,kp=0.05,is=1e-30, tox=1,rs=0.1) sw_vcsp..
th JUNCTION REV October 2002 FDP3672 CTHERM1 TH 6 3.2e-3 CTHERM2 6 5 3.3e-3 CTHERM3 5 4 3.4e-3 CTHERM4 4 3 3.5e-3 CTHERM5 3 2 6.4e-3 CTHERM6 2 TL 1.9e-2 RTHERM1 CTHERM1 6 RTHERM1 TH 6 5.5e-4 RTHERM2 6 5 5.0e-3 RTHERM3 5 4 4.5e-2 RTHERM4 4 3 10.5e-2 RTHERM5 3 2 3.4e-1 RTHERM6 2 TL 3.5e-1 RTHERM2 CTHERM2 5 SABER Thermal Model SABER thermal model FDP3672 template thermal_model th tl thermal_c th, tl { cctherm.ctherm1 th 6 =3.2e-3 ctherm.ctherm2 6 5 =3.3e-3 ctherm.ctherm3 5 4 =3.4e-3 ctherm.
FDP3672 — N-Channel PowerTrench® MOSFET Mechanical Dimensions TO-220 3L Figure 21. TO-220, Molded, 3Lead, Jedec Variation AB Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision.
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