Datasheet

December 2013
FDP75N08A — N-Channel UniFET
TM
MOSFET
©2006 Fairchild Semiconductor Corporation
FDP75N08A Rev. C0
www.fairchildsemi.com
1
Features
Description
UniFET
TM
MOSFET is Fairchild Semiconductor’s high voltage
MOSFET family based on planar stripe and DMOS technology.
This MOSFET is tailored to reduce on-state resistance, and to
provide better switching performance and higher avalanche
energy strength. This device family is suitable for switching
power converter applications such as power factor correction
(PFC), flat panel display (FPD) TV power, ATX and electronic
lamp ballasts.
Absolute Maximum Ratings T
C
= 25°C unless otherwise noted.
TO-220
G
D
S
G
S
D
FDP75N08A
N-Channel UniFET
TM
MOSFET
75
V, 75 A, 11 m
75 A, 75 V, R
DS(on)
= 11 m @ V
GS
= 10 V
Low Gate Charge (Typ. 145 nC)
Low Crss (Typ. 86 pF)
Improved dv/dt Capability
Fast Switching
Thermal Characteristics
Symbol Parameter FDP75N08A
Unit
V
DSS
Drain-Source Voltage 75 V
I
D
Drain Current 75 A- Continuous (T
C
= 25°C)
- Continuous (T
C
= 100°C) 47 A
I
DM
Drain Current - Pulsed
(Note 1)
300 A
V
GSS
Gate-Source Voltage ± 20 V
E
AS
Single Pulsed Avalanche Energy
(Note 2)
1738 mJ
I
AR
Avalanche Current
(Note 1)
75 A
E
AR
Repetitive Avalanche Energy
(Note 1)
13.7 mJ
dv/dt Peak Diode Recovery dv/dt
(Note 3)
4.5 V/ns
P
D
Power Dissipation (T
C
= 25°C) 137 W
- Derate Above 25°C
1.09 W/°C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150 °C
T
L
Maximum Lead Temperature for Soldering,
1/8" from Case for 5 Seconds
300 °C
Symbol Parameter FDP75N08A
Unit
R
θJC
Thermal Resistance, Junction-to-Case, Max.
0.91 °C/W
R
θJA
Thermal Resistance, Junction-to-Ambient, Max.
62.5 °C/W

Summary of content (8 pages)