Datasheet
November 2013
FDP10N60NZ / FDPF10N60NZ — N-Channel UniFET
TM
II MOSFET
©2010 Fairchild Semiconductor Corporation
FDP10N60NZ / FDPF10N60NZ Rev. C1
www.fairchildsemi.com
1
FDP10N60NZ / FDPF10N60NZ
N-Channel UniFET
TM
II MOSFET
600 V, 10 A, 750 mΩ
Features
•R
DS(on)
= 640 mΩ (Typ.) @ V
GS
= 10 V, I
D
= 5 A
• Low Gate Charge (Typ. 23 nC)
•Low C
rss
(Typ. 10 pF)
• 100% Avalanche Tested
• Improved dv/dt Capability
• ESD Improved Capability
•RoHS Compliant
Applications
• LCD/ LED/ PDP TV
• Lighting
• Uninterruptible Power Supply
Description
UniFET
TM
II MOSFET is Fairchild Semiconductor’s high voltage
MOSFET family based on advanced planar stripe and DMOS
technology. This advanced MOSFET family has the smallest
on-state resistance among the planar MOSFET, and also pro-
vides superior switching performance and higher avalanche
energy strength. In addition, internal gate-source ESD diode
allows UniFET II MOSFET to withstand over 2kV HBM surge
stress. This device family is suitable for switching power con-
verter applications such as power factor correction (PFC), flat
panel display (FPD) TV power, ATX and electronic lamp bal-
lasts.
TO-220
G
D
S
TO-220F
G
D
S
G
D
S
MOSFET Maximum Ratings T
C
= 25
o
C unless otherwise noted.
*Dran current limited by maximum junction temperature.
Thermal Characteristics
Symbol Parameter FDP10N60NZ FDPF10N60NZ Unit
V
DSS
Drain to Source Voltage 600 V
V
GSS
Gate to Source Voltage ±25 V
I
D
Drain Current
- Continuous (T
C
= 25
o
C) 10 10*
A
- Continuous (T
C
= 100
o
C) 6 6*
I
DM
Drain Current - Pulsed (Note 1) 40 40* A
E
AS
Single Pulsed Avalanche Energy (Note 2) 550 mJ
I
AR
Avalanche Current (Note 1) 10 A
E
AR
Repetitive Avalanche Energy (Note 1) 18.5 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 10 V/ns
P
D
Power Dissipation
(T
C
= 25
o
C) 185 38 W
- Derate Above 25
o
C1.50.3W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds
300
o
C
Symbol Parameter
FDP10N60NZ FDPF10N60NZ
Unit
R
θJC
Thermal Resistance, Junction to Case, Max. 0.68 3.3
o
C/W
R
θJA
Thermal Resistance, Junction to Ambient, Max. 62.5 62.5