Datasheet
November 2013
FDPF16N50UT — N-Channel UniFET
TM
Ultra FRFET
TM
MOSFET
©2009 Fairchild Semiconductor Corporation
FDPF16N50UT Rev C1
www.fairchildsemi.com
1
FDPF16N50UT
N-Channel UniFET
TM
Ultra FRFET
TM
MOSFET
500 V, 15 A, 48
0 mΩ
Features
•
R
DS(on)
= 370 mΩ ( Typ.) @ V
GS
= 10 V, I
D
= 7.5 A
•
Low Gate Charge (Typ. 32 nC)
•
Low C
rss
(Typ. 20 pF)
•
100% Avalanche Tested
• Improved dv/dt Capability
•
RoHS Compliant
Description
UniFET
TM
MOSFET is Fairchild Semiconductor’s high voltage
MOSFET family based on planar stripe and DMOS technology. This
MOSFET is tailored to reduce on-state resistance, and to provide
better switching performance and higher avalanche energy strength.
UniFET Ultra FRFET
TM
MOSFET has much superior body diode
reverse recovery performance. Its t
rr
is less than 50nsec and the
reverse dv/dt immunity is 20V/nsec while normal planar MOSFETs
have over 200nsec and 4.5V/nsec respectively. Therefore UniFET
Ultra FRFET MOSFET can remove additional component and improve
system reliability in certain applications that require performance
improvement of the MOSFET’s body diode. This device family is
suitable for switching power converter applications such as power
factor correction (PFC), flat panel display (FPD) TV power, ATX and
electronic lamp ballasts.
Applications
• LCD/LED/PDP TV
• Lighting
• Uninterruptible Power Supply
MOSFET Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter
FDPF16N50UT
Unit
V
DSS
Drain to Source Voltage 500 V
V
GSS
Gate to Source Voltage ±30 V
I
D
Drain Current
- Continuous (T
C
= 25
o
C)
15*
A
- Continuous (T
C
= 100
o
C)
9*
I
DM
Drain Current - Pulsed (Note 1) 60* A
E
AS
Single Pulsed Avalanche Energy (Note 2) 610 mJ
I
AR
Avalanche Current (Note 1) 15 A
E
AR
Repetitive Avalanche Energy (Note 1) 20 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 20 V/ns
P
D
Power Dissipation
(T
C
= 25
o
C) 38.5 W
- Derate above 25
o
C 0.3 W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering,
1/8” from Case for 5 Seconds
300
o
C
Symbol Parameter FDPF16N50UT
Unit
R
JC
Thermal Resistance, Junction to Case, Max.
3.3
o
C/W
R
JA
Thermal Resistance, Junction to Ambient, Max.
62.5
*Drain current limited by maximum junction temperature
TO-220F
G
D
S
G
S
D