Datasheet
December 2013
FDPF3860T — N-Channel PowerTrench
®
MOSFET
©2008 Fairchild Semiconductor Corporation
FDPF3860T Rev. C5
www.fairchildsemi.com
1
FDPF3860T
N-Channel PowerTrench
®
MOSFET
100 V, 20 A, 38.2 mΩ
Features
•R
DS(on)
= 29.1 mΩ (Typ.) @ V
GS
= 10 V, I
D
= 5.9 A
• Fast Switching Speed
• Low Gate Charge
• High Performance Trench Technology for Extremely Low
R
DS(on)
• High Power and Current Handling Capability
•RoHS Compliant
Description
This N-Channel MOSFET is produced using Fairchild
Semiconductor’s advanced PowerTrench
®
process that has
been tailored to minimize the on-state resistance while main-
taining superior switching performance.
Applications
• Consumer Appliances
• LCD/LED/PDP TV
• Synchronous Rectification
• Uninterruptible Power Supply
• Micro Solar Inverter
TO-220F
G
D
S
G
S
D
MOSFET Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter FDPF3860T Unit
V
DSS
Drain to Source Voltage 100 V
V
GSS
Gate to Source Voltage ±20 V
I
D
Drain Current
- Continuous (T
C
= 25
o
C) 20
A
- Continuous (T
C
= 100
o
C) 12.7
I
DM
Drain Current - Pulsed (Note 1) 80 A
E
AS
Single Pulsed Avalanche Energy (Note 2) 278 mJ
I
AR
Avalanche Current (Note 1) 20 A
E
AR
Repetitive Avalanche Energy (Note 1) 3.4 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 15 V/ns
P
D
Power Dissipation
(T
C
= 25
o
C) 33.8 W
- Derate Above 25
o
C0.27W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds
300
o
C
Symbol Parameter FDPF3860T Unit
R
θJC
Thermal Resistance, Junction to Case, Max. 3.7
o
C/W
R
θJA
Thermal Resistance, Junction to Ambient, Max. 62.5