Datasheet
November 2013
FDP39N20 / FDPF39N20 — N-Channel UniFET
TM
MOSFET
©2007 Fairchild Semiconductor Corporation
FDP39N20 / FDPF39N20 Rev. C1
www.fairchildsemi.com
1
FDP39N20 / FDPF39N20
N-Channel UniFET
TM
MOSFET
200 V, 39 A, 66 mΩ
Features
•R
DS(on)
= 66 mΩ (Max.) @ V
GS
= 10 V, I
D
= 19.5 A
• Low Gate Charge (Typ. 38 nC)
•Low C
rss
(Typ. 57 pF)
• 100% Avalanche Tested
Applications
•PDP TV
• Lighting
• Uninterruptible Power Supply
• AC-DC Power Supply
Description
UniFET
TM
MOSFET is Fairchild Semiconductor’s high voltage
MOSFET family based on planar stripe and DMOS technology.
This MOSFET is tailored to reduce on-state resistance, and to
provide better switching performance and higher avalanche
energy strength. This device family is suitable for switching
power converter applications such as power factor correction
(PFC), flat panel display (FPD) TV power, ATX and electronic
lamp ballasts.
TO-220
G
D
S
TO-220F
G
D
S
G
S
D
Absolute Maximum Ratings T
C
= 25°C unless otherwise noted.
Thermal Characteristics
Symbol Parameter FDP39N20 FDPF39N20 Unit
V
DSS
Drain-Source Voltage 200 V
I
D
Drain Current - Continuous (T
C
= 25°C)
- Continuous (T
C
= 100°C)
39
23.4
39 *
23.4 *
A
A
I
DM
Drain Current - Pulsed
(Note 1)
156 156 * A
V
GSS
Gate-Source voltage ±30 V
E
AS
Single Pulsed Avalanche Energy
(Note 2)
860 mJ
I
AR
Avalanche Current
(Note 1)
39 A
E
AR
Repetitive Avalanche Energy
(Note 1)
25.1 mJ
dv/dt Peak Diode Recovery dv/dt
(Note 3)
4.5 V/ns
P
D
Power Dissipation (T
C
= 25°C)
- Derate Above 25°C
251
2.0
37
0.29
W
W/°C
T
J,
T
STG
Operating and Storage Temperature Range -55 to +150 °C
T
L
Maximum Lead Temperature for Soldering,
1/8” from Case for 5 Seconds
300 °C
Symbol Parameter FDP39N20 FDPF39N20 Unit
R
θJC
Thermal Resistance, Junction-to-Case, Max. 0.5 3.4
°C/W
R
θJA
Thermal Resistance, Junction-to-Ambient, Max. 62.5 62.5
* Drain current limited by maximum junction temperature.