Datasheet
December 2013
FDP5N50NZ / FDPF5N50NZ — N-Channel UniFET
TM
II MOSFET
©2010 Fairchild Semiconductor Corporation
FDP5N50NZ / FDPF5N50NZ Rev. C1
www.fairchildsemi.com
1
FDP5N50NZ / FDPF5N50NZ
N-
Channel UniFET
TM
II MOSFET
5
00
V, 4.5 A, 1.5
Ω
Features
•R
DS(on)
= 1.38 Ω (Typ.) @ V
GS
= 10 V, I
D
= 2.25 A
•
Low Gate Charge (Typ. 9 nC)
•
Low C
RSS
(Typ. 4 pF)
• 100% Avalanche Tested
• Improved dv/dt Capability
• ESD Improved Capability
•RoHS Compliant
Applications
• LCD/ LED TV
• Lighting
• Uninterruptible Power Supply
• AC-DC Power Supply
Description
UniFET
TM
II MOSFET is Fairchild Semiconductor’s high voltage
MOSFET family based on advanced planar stripe and DMOS
technology. This advanced MOSFET family has the smallest
on-state resistance among the planar MOSFET, and also pro-
vides superior switching performance and higher avalanche
energy strength. In addition, internal gate-source ESD diode
allows UniFET II MOSFET to withstand over 2kV HBM surge
stress. This device family is suitable for switching power con-
verter applications such as power factor correction (PFC), flat
panel display (FPD) TV power, ATX and electronic lamp bal-
lasts.
TO-220
G
D
S
TO-220F
G
D
S
G
D
S
MOSFET Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter
FDP5N50NZ FDPF5N50NZ
Unit
R
θJC
Thermal Resistance, Junction to Case, Max. 1.6 4.1
o
C/W
R
θJA
Thermal Resistance, Junction to Ambient, Max. 62.5 62.5
Symbol Parameter FDP5N50NZ FDPF5N50NZ
Unit
V
DSS
Drain to Source Voltage 500 V
V
GSS
Gate to Source Voltage ±25 V
I
D
Drain Current
- Continuous (T
C
= 25
o
C)
4.5 4.5*
A
- Continuous (T
C
= 100
o
C)
2.7 2.7*
I
DM
Drain Current - Pulsed (Note 1) 18 18* A
E
AS
Single Pulsed Avalanche Energy (Note 2) 160 mJ
I
AR
Avalanche Current (Note 1) 4.5 A
E
AR
Repetitive Avalanche Energy (Note 1) 7.8 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 10 V/ns
P
D
Power Dissipation
(T
C
= 25
o
C) 78 30 W
- Derate above 25
o
C 0.62 0.24 W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering ,
1/8” from Case for 5 Seconds.
300
o
C
*Drain current limited by maximum junction temperature