Datasheet
October 2013
FDPF8N50NZF — N-Channel UniFET
TM
II FRFET
®
MOSFET
©2010 Fairchild Semiconductor Corporation
FDPF8N50NZF Rev. C1
www.fairchildsemi.com
1
FDPF8N50NZF
N-Channel UniFET
TM
II FRFET
®
MOSFET
500 V, 7 A, 1
Features
•R
DS(on)
= 850 m (Typ.) @ V
GS
= 10 V, I
D
= 3.25 A
• Low Gate Charge (Typ. 14 nC)
• Low C
rss
(Typ. 5 pF)
• 100% Avalanche Tested
• Improve dv/dt Capability
• ESD Improved Capability
• RoHS Compliant
Applications
• LCD/LED TV
• Lighting
• Uninterruptible Power Supply
• AC-DC Power Supply
Description
UniFET
TM
II MOSFET is Fairchild Semiconductor’s high voltage
MOSFET family based on advanced planar stripe and DMOS
technology. This advanced MOSFET family has the smallest
on-state resistance among the planar MOSFET, and also
provides superior switching performance and higher avalanche
energy strength. In addition, internal gate-source ESD diode
allows UniFET II MOSFET to withstand over 2kV HBM surge
stress. The body diode’s reverse recovery performance of
UniFET II FRFET
®
MOSFET has been enhanced by lifetime
control. Its t
rr
is less than 100nsec and the reverse dv/dt
immunity is 15V/ns while normal planar MOSFETs have over
200nsec and 4.5V/nsec respectively. Therefore, it can remove
additional component and improve system reliability in certain
applications in which the performance of MOSFET’s body diode
is significant. This device family is suitable for switching power
converter applications such as power factor correction (PFC),
flat panel display (FPD) TV power, ATX and electronic lamp
ballasts.
MOSFET Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter FDPF8N50NZF Unit
V
DSS
Drain to Source Voltage 500 V
V
GSS
Gate to Source Voltage ±25 V
I
D
Drain Current
- Continuous (T
C
= 25
o
C) 7*
A
- Continuous (T
C
= 100
o
C) 4.2*
I
DM
Drain Current - Pulsed (Note 1) 28* A
E
AS
Single Pulsed Avalanche Energy (Note 2) 93 mJ
I
AR
Avalanche Current (Note 1) 7 A
E
AR
Repetitive Avalanche Energy (Note 1) 13 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 20 V/ns
P
D
Power Dissipation
(T
C
= 25
o
C) 40 W
- Derate above 25
o
C0.32W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
300
o
C
Symbol Parameter FDPF8N50NZF Unit
R
JC
Thermal Resistance, Junction to Case, Max. 3.1
o
C/W
R
JA
Thermal Resistance, Junction to Ambient, Max. 62.5
*Drain current limited by maximum junction temperature
TO-220F
G
D
S
G
D
S