Datasheet
November 2013
FDPF8N60ZUT — N-Channel UniFET
TM
II Ultra FRFET
TM
MOSFET
©2012 Fairchild Semiconductor Corporation
FDPF8N60ZUT Rev. C2
www.fairchildsemi.com
1
FDPF8N60ZUT
N-Channel UniFET
TM
II Ultra FRFET
TM
MOSFET
600 V, 6.5 A, 1.35 Ω
Features
•R
DS(on)
= 1.15 Ω (Typ.) @ V
GS
= 10 V, I
D
= 3.25 A
• Low Gate Charge (Typ. 20 nC)
•Low C
rss
(Typ. 10 pF)
• 100% Avalanche Tested
• Improved dv/dt Capability
•RoHS Compliant
Applications
• LCD/LED TV
• Lighting
• Uninterruptible Power Supply
• AC-DC Power Supply
Description
UniFET
TM
II MOSFET is Fairchild Semiconductor’s high voltage
MOSFET family based on advanced planar stripe and DMOS
technology. This advanced MOSFET family has the smallest
on-state resistance among the planar MOSFET, and also pro-
vides superior switching performance and higher avalanche
energy strength. In addition, internal gate-source ESD diode
allows UniFET II MOSFET to withstand over 2kV HBM surge
stress. UniFET II Ultra FRFET
TM
MOSFET has much superior
body diode reverse recovery performance. Its t
rr
is less than
50nsec and the reverse dv/dt immunity is 20V/nsec while nor-
mal planar MOSFETs have over 200nsec and 4.5V/nsec
respectively. Therefore UniFET II Ultra FRFET MOSFET can
remove additional component and improve system reliability in
certain applications that require performance improvement of
the MOSFET’s body diode. This device family is suitable for
switching power converter applications such as power factor
correction (PFC), flat panel display (FPD) TV power, ATX and
electronic lamp ballasts.
TO-220F
G
D
S
G
D
S
MOSFET Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter FDPF8N60ZUT Unit
V
DSS
Drain to Source Voltage 600 V
V
GSS
Gate to Source Voltage ±30 V
I
D
Drain Current
- Continuous (T
C
= 25
o
C) 6.5*
A
- Continuous (T
C
= 100
o
C) 3.9*
I
DM
Drain Current - Pulsed (Note 1) 26* A
E
AS
Single Pulsed Avalanche Energy (Note 2) 420 mJ
I
AR
Avalanche Current (Note 1) 6.5 A
E
AR
Repetitive Avalanche Energy (Note 1) 13.5 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 20 V/ns
P
D
Power Dissipation
(T
C
= 25
o
C) 34.5 W
- Derate Above 25
o
C0.28W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds
300
o
C
Symbol Parameter
FDPF8N60ZUT
Unit
R
θJC
Thermal Resistance, Junction to Case, Max. 3.6
o
C/W
R
θJA
Thermal Resistance, Junction to Ambient, Max. 62.5
*Drain current limited by maximum junction temperature