Datasheet

June 2011
FDS89161LZ Dual N-Channel PowerTrench
®
MOSFET
©2011 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com
FDS89161LZ Rev. C4
FDS89161LZ
Dual N-Channel PowerTrench
®
MOSFET
100 V, 2.7 A, 105 mΩ
Features
Max r
DS(on)
= 105 mΩ at V
GS
= 10 V, I
D
= 2.7 A
Max r
DS(on)
= 160 mΩ at V
GS
= 4.5 V, I
D
= 2.1 A
High performance trench technology for extremely low r
DS(on)
High power and current handling capability in a widely used
surface mount package
CDM ESD protection level > 2KV typical (Note 4)
100% UIL Tested
RoHS Compliant
General Description
This N-Channel logic Level MOSFETs are produced using
Fairchild Semiconductor‘s advanced Power Trench
®
process
that has been special tailored to minimize the on-state
resisitance and yet maintain superior switching performance.
G-S zener has been added to enhance ESD voltage level
.
Application
DC-DC conversion
MOSFET Maximum Ratings T
A
= 25 °C unless otherwise noted
Thermal Characteristics
Package Marking and Ordering Information
Symbol Parameter Ratings Units
V
DS
Drain to Source Voltage 100 V
V
GS
Gate to Source Voltage ±20 V
I
D
Drain Current -Continuous 2.7
A
-Pulsed 15
E
AS
Single Pulse Avalanche Energy (Note 3) 13 mJ
P
D
Power Dissipation T
C
= 25 °C 31
W
Power Dissipation T
A
= 25 °C (Note1a) 1.6
T
J
, T
STG
Operating and Storage Junction Temperature Range -55 to +150 °C
R
θJC
Thermal Resistance, Junction to Case (Note 1) 4.0
°C/W
R
θJA
Thermal Resistance, Junction to Ambient (Note 1a) 78
Device Marking Device Package Reel Size Tape Width Quantity
FDS89161LZ FDS89161LZ SO-8 13 ’’ 12 mm 2500 units
G2
S1
G1
S2
D2
D2
D1
D1
Pin 1
SO-8
D1
D1
D2
D2
S2
S1
G1
G2
4
3
2
1
5
6
7
8
Q2
Q1