Datasheet
FDT86113LZ N-Channel PowerTrench
®
MOSFET
©2011 Fairchild Semiconductor Corporation
FDT86113LZ Rev.C
www.fairchildsemi.com
1
March 2011
FDT86113LZ
N-Channel PowerTrench
®
MOSFET
100 V, 3.3 A, 100 m:
Features
Max r
DS(on)
= 100 m: at V
GS
= 10 V, I
D
= 3.3 A
Max r
DS(on)
= 145 m: at V
GS
= 4.5 V, I
D
= 2.7 A
High performance trench technology for extremely low r
DS(on)
High power and current handling capability in a widely used
surface mount package
HBM ESD protection level > 3 KV typical (Note 4)
100% UIL tested
RoHS Compliant
General Description
This N-Channel logic Level MOSFETs are produced using
Fairchild Semiconductor‘s advanced Power Trench
®
process
that has been special tailored to minimize the on-state resistance
and yet maintain superior switching performance. G-S zener
has been added to enhance ESD voltage level.
Application
DC - DC Switch
G
D
S
D
SOT-223
MOSFET Maximum Ratings T
C
= 25 °C unless otherwise noted
Thermal Characteristics
Package Marking and Ordering Information
Symbol Parameter Ratings Units
V
DS
Drain to Source Voltage 100 V
V
GS
Gate to Source Voltage ±20 V
I
D
Drain Current -Continuous 3.3
A
-Pulsed 12
E
AS
Single Pulse Avalanche Energy (Note 3) 9 mJ
P
D
Power Dissipation T
A
= 25 °C (Note 1a) 2.2
W
Power Dissipation T
A
= 25 °C (Note 1b) 1.0
T
J
, T
STG
Operating and Storage Junction Temperature Range -55 to +150 °C
R
TJC
Thermal Resistance, Junction to Case 12
°C/W
R
TJA
Thermal Resistance, Junction to Ambient (Note 1a) 55
Device Marking Device Package Reel Size Tape Width Quantity
86113LZ FDT86113LZ SOT-223 13 ’’ 12 mm 2500 units