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FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

FOD060L, FOD260L Rev. 1.0.5

October 2011

FOD060L, FOD260L

3.3V/5V High Speed-10 MBit/s

Logic Gate Optocouplers

Features

■

FOD060L in SO8 and FOD260L in 8-pin DIP

■

Very high speed – 10 MBit/s

■

Superior CMR — 50 kV/µs at 1,000V peak

■

Fan-out of 8 over -40°C to +85°C

■

Logic gate output

■

Strobable output

■

Wired OR-open collector

■

Safety and regulatory approvals

– UL1577

– DIN EN/IEC 60747-5-2

Applications

■

Ground loop elimination

■

LSTTL to TTL, LSTTL or 5-volt CMOS

■

Line receiver, data transmission

■

Data multiplexing

■

Switching power supplies

■

Pulse transformer replacement

■

Computer-peripheral interface

Description

These optocouplers consist of an AlGaAS LED, optically

coupled to a very high speed integrated photo-detector

logic gate. Devices include a strobable output. This

output features an open collector, thereby permitting

wired OR outputs. The coupled parameters are

guaranteed over the temperature range of -40°C to

+85°C. A maximum input signal of 5 mA will provide a

minimum output sink current of 13 mA (fan out of 8). An

internal noise shield provides superior common mode

rejection of typically 50 kV/µs at 1,000V common mode.

Package

Truth Table (Positive Logic)

*Devices with pin 7 not connected.

A 0.1 µF bypass capacitor must be connected between pins 5 and 8. (See Note 1)

Input Enable Output

On H L

Off H H

On L H

Off L H

On* NC* L*

Off* NC* H*

N/C

GND

N/C

Summary of content (19 pages)

PAGE 1
FOD060L, FOD260L 3.
PAGE 2
Symbol Parameter Value Units TSTG Storage Temperature -40 to +125 °C TOPR Operating Temperature -40 to +85 °C EMITTER IF DC/Average Forward Input Current VE Enable Input Voltage, not to exceed VCC by more than 500 mV 50 mA VCC + 0.5V V VR Reverse Input Voltage 5.0 V PI Power Dissipation 45 mW VCC Supply Voltage (1 minute max) 7.0 V Output Current 50 mA VO Output Voltage 7.
PAGE 3
Individual Component Characteristics Symbol Parameter Test Conditions Min. Typ. Max. Unit 1.8 V EMITTER VF Input Forward Voltage IF = 10 mA 1.4 TA = 25°C 1.75 BVR Input Reverse Breakdown Voltage IR = 10 µA CIN Input Capacitance VF = 0, f = 1 MHz 6.0 pF IF = 10 mA -1.9 mV/°C ∆VF/∆TA Input Diode Temperature Coefficient 5.0 V DETECTOR ICCH High Level Supply Current VE = 0.5 V, IF = 0 mA, VCC = 3.3 V 3.5 7 mA ICCL Low Level Supply Current VE = 0.5 V, IF = 0 mA, VCC = 3.
PAGE 4
Symbol DC Characteristics Test Conditions Min. Typ. Max. Unit IOH High Level Output Current IF = 250 µA, VCC = 3.3 V, VO = 3.3 V, VE = 2.0 V (Note 2) 0.01 50 µA VOL Low Level Output Voltage VCC = 3.3 V, IF = 5 mA, IOL = 13 mA, VE = 2.0 V (Note 2) 0.3 0.6 V IFT Input Threshold Current VCC = 3.3 V, VO = 0.6 V, IOL = 13 mA, VE = 2.0 V (Note 2) 1 5 mA Isolation Characteristics (TA = -40°C to +85°C Unless otherwise specified. Typical value is measured at TA = 25°C and VCC = 3.
PAGE 5
Fig. 1 Input Forward Current vs. Forward Voltage Fig. 2 Input Threshold Current vs. Ambient Temperature 2.5 100 ITH - Input Threshold Current (mA) VCC = 3.3V VO = 0.6V I F - Forward Current (mA) 10 TA = 100°C 1 TA = -40°C TA = 85°C 0.1 TA = 0°C TA = 25°C 0.01 0.001 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 2.0 1.5 FOD060L RL = 350Ω, 1kΩ, 4kΩ 1.0 FOD260L RL = 350Ω, 1kΩ, 4kΩ 0.5 0.0 -40 1.7 -20 VF - Forward Voltage (V) 0.6 40 60 80 100 20 CC = 3.
PAGE 6
Fig. 7 Rise and Fall Times vs. Ambient Temperature Fig. 8 Pulse Width Distortion vs. Ambient Temperature 30 35 V = 3.3V V IF = 7.5mA PWD - Pulse Width Distortion (ns) tr, tf, - Rise, Fall Time (ns) 30 CC RL = 350Ω 25 tr 20 15 10 5 25 CC = 3.3V IF = 7.5mA RL = 350Ω 20 FOD260L 15 FOD060L 10 5 tf 0 -40 -20 0 20 40 60 80 0 -40 100 TA - Ambient Temperature (°C) ©2008 Fairchild Semiconductor Corporation FOD060L, FOD260L Rev. 1.0.
PAGE 7
I F = 7.5 mA +3.3V 1 Input Monitor (IF) t PHL 8 2 7 3 6 4 5 0.1µF Bypass tPLH Output (VO ) RL 1.5 V Output (VO) CL 47Ω I F = 3.75 mA Input (I F) VCC 90% Output (VO ) GND 10% tf tr Fig. 9 Test Circuit and Waveforms for tPLH, tPHL, tr and tf. Pulse Generator tr = 5ns Z O = 50Ω Input Monitor (V E) +3.3V 3.0 V Input (VE ) VCC 1 8 1.5 V t EHL 7.5 mA 7 2 RL 0.1µF bypass 1.5 V Output (VO ) 6 3 t ELH Output (VO ) CL 4 GND 5 Fig. 10 Test Circuit tEHL and tELH.
PAGE 8
IF A 8 2 7 3 6 +3.3V 0.1µf bypass 350Ω B VFF 4 GND Output (VO) 5 VCM Pulse Gen VCM 0V Peak CM H 3.3V Switching Pos. (A), IF = 0 VO VO (Min) VO (Max) Switching Pos. (B), IF = 7.5 mA VO 0.5 V CM L Fig. 11 Test Circuit Common Mode Transient Immunity ©2008 Fairchild Semiconductor Corporation FOD060L, FOD260L Rev. 1.0.5 www.fairchildsemi.com 8 FOD060L, FOD260L — 3.
PAGE 9
FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers Package Dimensions Small Outline 0.164 (4.16) 0.144 (3.66) SEATING PLANE 0.202 (5.13) 0.182 (4.63) 0.010 (0.25) 0.006 (0.16) 0.143 (3.63) 0.123 (3.13) 0.008 (0.20) 0.003 (0.08) 0.021 (0.53) 0.011 (0.28) 0.244 (6.19) 0.224 (5.69) 0.050 (1.27) TYP Lead Coplanarity : 0.004 (0.10) MAX 0.024 (0.61) 0.060 (1.52) 0.275 (6.99) 0.155 (3.94) 0.050 (1.27) Note: All dimensions are in millimeters.
PAGE 10
FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers Package Dimensions (Continued) DIP Through Hole 9.40–9.91 Pin 1 6.35–6.86 1.14–1.78 3.68–3.94 5.08 MAX 3.05–3.90 0.51 MIN 0.41–0.56 (0.78) 2.54 BSC 0.20–0.40 7.62 TYP 0.4" Lead Spacing (Option T) 9.40–9.91 Pin 1 6.35–6.86 3.68–3.94 1.14–1.78 5.08 MAX 0.51 MIN 3.05–3.90 0.41–0.56 2.54 BSC 15.0° MAX 10.16 TYP (0.78) 0.20–0.40 Package drawings are provided as a service to customers considering Fairchild components.
PAGE 11
FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers Package Dimensions (Continued) SMT Surface Mount – 0.3" Lead Spacing (Option S) (2.54) (1.78) 9.40–9.91 Pin 1 (1.54) (7.49) 6.35–6.86 (10.54) (0.76) Recommended Land Pattern 1.14–1.78 3.68–3.94 5.08 MAX 0.20–0.40 (0.78) 0.51 MIN (0.41–0.56) 0.40 MIN Both sides 2.54 BSC 8.00 MIN 10.30 MAX Surface Mount – 0.4" Lead Spacing (Option TS) 9.40–9.91 (2.54) 1.50 (1.78) (1.54) ø1.00 TYP (9.96) 6.35–6.86 (13.00) (0.
PAGE 12
Part Number Package Packing Method FOD060L Small outline 8-pin Tube (50 units per tube) FOD060LR2 Small outline 8-pin Tape and Reel (2.
PAGE 13
FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers Marking Information (Continued) DIP and SMT 1 260L XX YY B V 3 2 6 5 4 Definitions 1 Fairchild logo 2 Device number 3 VDE mark (Note: Only appears on parts ordered with DIN EN/IEC 60747-5-2 option – See order entry table) 4 Two digit year code, e.g., ‘11’ 5 Two digit work week ranging from ‘01’ to ‘53’ 6 Assembly package code ©2008 Fairchild Semiconductor Corporation FOD060L, FOD260L Rev. 1.0.5 www.fairchildsemi.
PAGE 14
Small Outline 8.0 ± 0.10 3.50 ± 0.20 2.0 ± 0.05 0.30 MAX Ø1.5 MIN 4.0 ± 0.10 1.75 ± 0.10 5.5 ± 0.05 12.0 ± 0.3 8.3 ± 0.10 5.20 ± 0.20 0.1 MAX Ø1.5 ± 0.1/-0 6.40 ± 0.20 User Direction of Feed Note: All dimensions are in millimeters. ©2008 Fairchild Semiconductor Corporation FOD060L, FOD260L Rev. 1.0.5 www.fairchildsemi.com 14 FOD060L, FOD260L — 3.
PAGE 15
Option S D0 P0 t K0 P2 E F A0 W1 d t P User Direction of Feed Symbol W W B0 Description D1 Dimension in mm Tape Width 16.0 ± 0.3 Tape Thickness 0.30 ± 0.05 P0 Sprocket Hole Pitch 4.0 ± 0.1 D0 Sprocket Hole Diameter 1.55 ± 0.05 E Sprocket Hole Location 1.75 ± 0.10 F Pocket Location 7.5 ± 0.1 2.0 ± 0.1 P2 P Pocket Pitch A0 Pocket Dimensions 12.0 ± 0.1 10.30 ±0.20 B0 10.30 ±0.20 K0 4.90 ±0.20 W1 d R ©2008 Fairchild Semiconductor Corporation FOD060L, FOD260L Rev. 1.0.
PAGE 16
Option TS D0 P0 t K0 P2 E F A0 W1 d t P User Direction of Feed Symbol W W B0 Description D1 Dimension in mm Tape Width 24.0 ± 0.3 Tape Thickness 0.40 ± 0.1 P0 Sprocket Hole Pitch D0 Sprocket Hole Diameter 1.55 ± 0.05 4.0 ± 0.1 E Sprocket Hole Location 1.75 ± 0.10 F Pocket Location 11.5 ± 0.1 P Pocket Pitch 16.0 ± 0.1 A0 Pocket Dimensions 12.80 ± 0.1 2.0 ± 0.1 P2 10.35 ± 0.1 B0 5.7 ±0.1 K0 W1 d R ©2008 Fairchild Semiconductor Corporation FOD060L, FOD260L Rev. 1.0.
PAGE 17
FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers Reflow Profile Small Outline 300 260°C 280 260 >245°C = 42 Sec 240 220 200 180 Temperature (°C) 160 Time above 140 183°C = 90 Sec 120 1.822°C/Sec Ramp up rate 100 80 60 40 33 Sec 20 0 0 60 120 180 270 360 Time (s) ©2008 Fairchild Semiconductor Corporation FOD060L, FOD260L Rev. 1.0.5 www.fairchildsemi.
PAGE 18
FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers Reflow Profile (Continued) DIP and SMT Temperature (°C) TP 260 240 TL 220 200 180 160 140 120 100 80 60 40 20 0 Max. Ramp-up Rate = 3°C/S Max. Ramp-down Rate = 6°C/S tP Tsmax tL Preheat Area Tsmin ts 120 240 360 Time 25°C to Peak Time (seconds) Profile Freature Pb-Free Assembly Profile Temperature Min. (Tsmin) 150°C Temperature Max.
PAGE 19
FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers ©2008 Fairchild Semiconductor Corporation FOD060L, FOD260L Rev. 1.0.5 www.fairchildsemi.