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FOD8318 — 2.5 A Output Current, IGBT Drive Optocoupler with Active Miller Clamp, Desaturation Detection, and Isolated Fault Sensing

FOD8318 Rev. 1.1.2

December 2012

FOD8318

2.5 A Output Current, IGBT Drive Optocoupler

with Active Miller Clamp, Desaturation Detection, and

Isolated Fault Sensing

Features

 High noise immunity characterized by common mode

rejection

– 35 kV / µs Minimum Common Mode Rejection

(Vcm = 1500 V

peak

)

 2.5 A peak output current driving capability for most

1200 V / 150 A IGBT

 Optically isolated fault sensing feedback

 Active Miller clamp to shut off the IGBT during high

dv/dt without needing a negative supply voltage

 “Soft” IGBT turn-off

 Built-in IGBT protection

– Desaturation detection

– Under-voltage lock out (UVLO) protection

 Wide supply voltage range from 15 V to 30 V

– Use of P-Channel MOSFETs at output stage

enables output voltage swing close to the supply

rail (rail-to-rail output)

 3.3 V / 5 V, CMOS/TTL-compatible inputs

 High Speed

– 500 ns max. propagation delay over full operating

temperature range

 Extended industrial temperate range, -40°C to 100°C

temperature range

 Safety and regulatory approvals

– UL1577, 4,243 V

RMS

for 1 min.

– DIN EN/IEC 60747-5-5,1,414 V

peak

working

insulation voltage, 8000 V

peak

transient isolation

voltage ratings

 R

DS(ON)

of 1  (typ.) offers lower power dissipation

 User configurable: inverting, non-inverting, auto-reset,

auto-shutdown

 8 mm creepage and clearance distances

Applications

 Industrial inverter

 Induction heating

 Isolated IGBT drive

Description

The FOD8318 is an advanced 2.5 A output current

IGBT drive optocoupler capable of driving most

1200 V / 150 A IGBTs. It is ideally suited for fast-switch-

ing driving of power IGBTs and MOSFETs used in motor

control inverter applications and high-performance

power systems. It consists of an integrated gate drive

optocoupler featuring low R

DS(ON)

CMOS transistors to

drive the IGBT from rail to rail and an integrated high-

speed isolated feedback for fault sensing. The FOD8318

has an active Miller clamp fuction to shut off the IGBT

during a high dv/dt situation without the need of a nega-

tive supply voltage. It offers critical protection features

necessary for preventing fault conditions that lead to

destructive thermal runaway of IGBTs.

It utilizes Fairchild’s proprietary Optoplanar

coplanar

packaging technology and optimized IC design to

achieve high noise immunity, characterized by high

common mode rejection and power supply rejection

specifications.

The device is housed in a compact 16-pin small outline

plastic package that meets the 8 mm creepage and

clearance requirements.

Summary of content (31 pages)

PAGE 1
FOD8318 2.5 A Output Current, IGBT Drive Optocoupler with Active Miller Clamp, Desaturation Detection, and Isolated Fault Sensing Features Description  High noise immunity characterized by common mode The FOD8318 is an advanced 2.5 A output current IGBT drive optocoupler capable of driving most 1200 V / 150 A IGBTs. It is ideally suited for fast-switching driving of power IGBTs and MOSFETs used in motor control inverter applications and high-performance power systems.
PAGE 2
VIN+ VIN– UVLO (VDD2 – VE) X X Active X X X DESAT Detected? FAULT VOUT* X X LOW Yes LOW LOW LOW X X X X LOW X HIGH X X X LOW HIGH LOW Not Active No HIGH HIGH *VOUT is always LOW with ‘clamp’ being active (gate voltage < 2 V above VSS). Pin Definitions Pin # Name Description 1 VIN+ Non-inverting gate drive control input 2 VIN– Inverting gate drive control input 3 VDD1 Positive input supply voltage (3 V to 5.
PAGE 3
VLED1+ 7 Output IC VDD1 3 13 Input IC 12 VIN+ 1 VIN– 2 VDD2 VS FAULT 6 GND1 VLED1– Driver LED1 Gate Drive Optocoupler 11 UVLO 4 8 Shield DESAT 9 14 RESET VO 5 Fault 16 LED2 10 VSS DESAT VE VCLAMP Miller Clamp Fault Sense Optocoupler VSS Shield 15 VLED2+ ©2010 Fairchild Semiconductor Corporation FOD8318 Rev. 1.1.2 www.fairchildsemi.com 3 FOD8318 — 2.
PAGE 4
As per DIN EN/IEC 60747-5-5. This optocoupler is suitable for “safe electrical insulation” only within the safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits. Symbol Parameter Min. Typ. Max. Unit Installation Classifications per DIN VDE 0110/1.
PAGE 5
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.
PAGE 6
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol TA VDD1 VDD2 – VSS VE – VSS VDD2 – VE VS Parameter Ambient Operating Temperature Input Supply Min. Max. Unit -40 +100 ºC Voltage(6) 3 5.
PAGE 7
Apply over all recommended conditions; typical value is measured at VDD1 = 5 V, VDD2 – VSS = 30 V, VE – VSS = 0 V, TA = 25 °C unless otherwise specified. Symbol IOL Parameter Low Level Output Current Conditions VO = VSS + 3 V (11) Min. Typ. 1 3 VO = VSS + 6 V 2.5 IOLF Low Level Output Current During Fault Condition VO – VSS = 14 V 90 185 VOH High Level Output Voltage IO = –100 mA VS – 1.0 V VS – 0.5 V VOL Low Level Output Voltage IO = 100 mA 0.
PAGE 8
Apply over all recommended conditions; typical value is measured at VDD1 = 5 V, VDD2 – VSS = 30 V, VE – VSS = 0 V, TA = 25 °C unless otherwise specified. Symbol Parameter tPHL Propagation Delay Time to Logic Low Output(17) tPLH Propagation Delay Time to Logic High Output(18) PWD Pulse Width Distortion, | tPHL – tPLH|(19) PDD Skew Conditions Min. Rg = 10 ¾, Cg = 10 nF, f = 10 kHz, Duty Cycle = 50 %(16) Propagation Delay Difference Between Any Two Parts or Channels, ( tPHL – tPLH)(20) Typ. Max.
PAGE 9
©2010 Fairchild Semiconductor Corporation FOD8318 Rev. 1.1.2 www.fairchildsemi.com 9 FOD8318 — 2.5 A Output Current, IGBT Drive Optocoupler with Active Miller Clamp, Desaturation Detection, and Isolated Fault Sensing 22. This is the amount of time from when the DESAT threshold is exceeded, until the FAULT output goes LOW. Refer to Figure 54. 23. This is the amount of time the DESAT threshold must be exceeded before VO begins to go LOW and the FAULT output to go LOW. Refer to Figure 54. 24.
PAGE 10
Figure 1. Fault Logic Low Output Current (IFAULTL) vs. Fault Logic Low Output Voltage (VFAULTL) Figure 2. Output High Current (IOH) vs.
PAGE 11
Figure 7. Output High Voltage (VOH) vs. Output High Current (IOH) 5 VOL – OUTPUT LOW VOLTAGE (V) VOH – OUTPUT HIGH VOLTAGE (V) 30 29 TA = -40 °C 25 °C 28 100 °C 27 26 VDD2 – V SS = 30 V VDD1 = 5 V VIN+ = 5 V 25 0 0.5 1.0 1.5 Figure 8. Output Low Voltage (VOL) vs. Output Low Current (IOL) 2.0 VDD2 – V SS = 30 V VDD1 = 5 V VIN+ = 0 V 4 3 TA = 100 °C 2 -40 °C 1 0 2.5 0 0.5 IOH – OUTPUT HIGH CURRENT (A) Figure 9. Supply Current (IDD1) vs. Temperature 2.
PAGE 12
Figure 14. Source Current (IS) vs. Output Current (IO) 3.0 -0.15 2.5 IS – SOURCE CURRENT (mA) IE – SUPPLY CURRENT (mA) Figure 13. Supply Current (IE) vs. Temperature -0.10 IEL -0.20 IEH -0.25 -0.30 -0.35 VDD2 – V SS = 30 V VDD1 = 5 V VIN+ = 5 V (I EH) / 0 V (I EL) -0.40 -40 -20 0 20 40 60 80 2.0 1.5 1.0 0.5 0 100 -40 °C 25 °C 100 °C VDD2 – V SS = 30 V VDD1 = 5 V VIN+ = 5 V 0 0.5 1.0 TA – TEMPERATURE (°C) Figure 15. Under-Voltage Lockout Threshold (VUVLO) vs.
PAGE 13
Figure 20. Propagation Delay to Logic Low Output (tPHL) vs. Temperature Figure 19. Propagation Delay to Logic High Output (tPLH) vs. Temperature 0.35 VDD2 – V SS = 30 V f = 10 kHz 50 % Duty Cycle RL = 10 Ω, CL = 10 nF tPHL – PROPAGATION DELAY (μs) tPLH – PROPAGATION DELAY (μs) 0.45 0.40 0.35 0.30 VDD1 = 4.5 V VDD1 = 5.0 V VDD1 = 5.5 V 0.25 -40 -20 0 20 40 60 80 VDD2 – V SS = 30 V f = 10 kHz 50 % Duty Cycle RL = 10 Ω, CL = 10 nF 0.30 0.25 0.20 VDD1 = 4.5 V VDD1 = 5.0 V VDD1 = 5.5 V 0.
PAGE 14
Figure 25. DESAT Sense to Low Fault Signal Delay (tDESAT(FAULT)) vs. Temperature Figure 26. DESAT Sense to 10 % VO Delay (tDESAT(10 %)) vs. Load Capacitance (CL) 0.008 VDD2 – V SS = 30 V VDD1 = 5 V VIN+ = 5 V RL = 10 Ω, CL = 10 nF 2.4 tDESAT(10 %) – DESAT SENSE TO 10% VO tDESAT(FAULT) – DESAT SENSE TO LOW FAULT SIGNAL DELAY (μs) 2.6 2.2 VE – V SS = 0 V VE – V SS = 15 V 2.0 1.8 1.6 -40 -20 0 20 40 60 80 100 VDD2 – V SS = 15 V or 30 V VDD1 = 5 V VIN+ = 5 V RL = 10 Ω 0.
PAGE 15
Figure 31. Time to Good Power (tGP) vs. Temperature Figure 32. Clamp Low Level Sinking Current (ICLAMPL) vs. Temperature 100 3 VDD2 = 15 V to 30 V VDD1 = 5 V VIN+ = 5 V f = 50 Hz 50 % Duty Cycle ICLAMP – CLAMP LOW LEVEL SINKING CURRENT (A) tGP – TIME TO GOOD POWER (μs) 120 80 60 40 20 0 -40 -20 0 20 40 60 80 VDD2 – VSS = 30 V VDD1 = 5 V 2.5 VIN+ = 5 V VCLAMP = 2.5 V 2.0 1.5 1.0 0.5 0 -40 100 -20 0 TA – TEMPERATURE (°C) 2.6 3.0 VDD2 – VSS = 30 V VDD1 = 5 V 2.
PAGE 16
+ – 5V VFAULT IFAULT VFAULT = 0.4 V for IFAULTL VE 16 VIN+ 2 VIN– VLED2+ 15 3 VDD1 DESAT 14 4 GND1 5 RESET VS 12 6 FAULT VO 11 7 VLED1+ VCLAMP 10 8 VLED1-* VSS 0.1 μF – + FOD8318 1 A 0.1 μF 10 mA VDD2 13 Switch A closed for IFAULTL Switch A opened for IFAULTH 9 VFAULT = 5.0 V for IFAULTH *Pin 8 (VLED1-) is internally connected to pin 4 (GND1). Figure 35. Fault Output Current (IFAULTL) and (IFAULTH) Test Circuit Pulse Gen PW = 10 μs Period = 5 ms + – 0.
PAGE 17
FOD8318 — 2.5 A Output Current, IGBT Drive Optocoupler with Active Miller Clamp, Desaturation Detection, and Isolated Fault Sensing Test Circuits (Continued) A B + – 5V 0.1 μF FOD8318 VE 16 1 VIN+ 2 VIN– VLED2+ 15 3 VDD1 DESAT 14 4 GND1 5 RESET VS 12 6 FAULT VO 11 7 VLED1+ VCLAMP 10 8 VLED1-* VSS 0.1 μF VDD2 13 VO Switch A for VOH test Switch B for VOL test + – 100 mA pulsed 30 V B A 3 kΩ VE + – 0.
PAGE 18
5V + – VE 16 VIN+ 2 VIN– VLED2+ 15 3 VDD1 DESAT 14 4 GND1 5 RESET VDESAT + – 0.1 μF FOD8318 1 ICHG/DSCHG 0.1 μF VE + – VDD2 13 VS 12 6 FAULT VO 11 7 VLED1+ VCLAMP 10 8 VLED1-* VSS VRL VO RL 0.1 μF IOLF 3 kΩ 30 V + – 10 nF 9 *Pin 8 (VLED1-) is internally connected to pin 4 (GND1). Figure 41.
PAGE 19
LOW to HIGH + – 5V 0.1 μF + – FOD8318 VE 16 1 VIN+ 2 VIN– VLED2+ 15 3 VDD1 DESAT 14 4 GND1 5 RESET VS 12 6 FAULT VO 11 7 VLED1+ VCLAMP 10 8 VLED1-* VSS 100 pF 0.1 μF + – VE VDD2 13 VO 0.1 μF + – 30 V RL 3 kΩ VFAULT 10 nF 9 *Pin 8 (VLED1-) is internally connected to pin 4 (GND1). Figure 44. DESAT Sense (tDESAT(90 %), tDESAT(10 %)), DESAT Fault (tDESAT(FAULT)), and (tDESAT(LOW)) Test Circuit 0.
PAGE 20
5V 0.1 μF 1 kΩ FOD8318 VE 16 1 VIN+ 2 VIN– VLED2+ 15 3 VDD1 DESAT 14 25 V 0.1 μF VDD2 13 4 GND1 5 RESET VS 12 6 FAULT VO 11 7 VLED1+ VCLAMP 10 8 VLED1-* VSS SCOPE 10 Ω 300 pF 10 nF 9 VCM Floating GND *Pin 8 (VLED1-) is internally connected to pin 4 (GND1). Figure 47. Common Mode Low (CML) Test Circuit at LED1 Off 5V FOD8318 VE 16 1 VIN+ 2 VIN– VLED2+ 15 3 VDD1 DESAT 14 4 GND1 5 RESET VS 12 6 FAULT VO 11 7 VLED1+ VCLAMP 10 8 VLED1-* VSS 25 V 0.
PAGE 21
FOD8318 — 2.5 A Output Current, IGBT Drive Optocoupler with Active Miller Clamp, Desaturation Detection, and Isolated Fault Sensing Test Circuits (Continued) 5V 0.1 μF 1 kΩ SCOPE 300 pF FOD8318 VE 16 1 VIN+ 2 VIN– VLED2+ 15 3 VDD1 DESAT 14 4 GND1 5 RESET VS 12 6 FAULT VO 11 7 VLED1+ VCLAMP 10 8 VLED1-* VSS 25 V VDD2 13 0.1 μF 10 Ω 9 VCM 10 nF Floating GND *Pin 8 (VLED1-) is internally connected to pin 4 (GND1). Figure 49.
PAGE 22
5V + – 0.1 μF FOD8318 VE 16 1 VIN+ 2 VIN– VLED2+ 15 3 VDD1 DESAT 14 4 GND1 5 RESET VS 12 6 FAULT VO 11 7 VLED1+ VCLAMP 10 0V 0.1 μF + – VDD2 13 0.1 μF 30 V + – ICLAMPL + 3 kΩ – 8 VLED1-* VSS Pulsed VCLAMP 9 *Pin 8 (VLED1-) is internally connected to pin 4 (GND1). Figure 51.
PAGE 23
VIN+ 2.5 V VIN– 0V 2.5 V tR tF 90 % 50 % 10 % VO tPLH tPHL Figure 53. Propagation Delay (tPLH, tPHL), Rise Time (tR), and Fall Time (tF) Timing Diagram RESET 50 % tDESAT (LOW) 7V VDESAT tRESET (FAULT) 50 % tDESAT (90 %) 90 % VO 10 % tDESAT (10 %) 50 % (0.5 x VDD1) FAULT tDESAT (FAULT) Figure 54.
PAGE 24
Micro Controller 5 V + 0.1 μF 3 kΩ – 330 pF FOD8318 1 VIN+ VE 16 2 VIN– VLED2+ 15 3 VDD1 DESAT 14 4 GND1 VDD2 13 5 RESET VS 12 6 FAULT VO 11 7 VLED1+ VCLAMP 10 8 VLED1-* VSS CBLANK 1 μF 10 μF 100 pF 1 kΩ + – 1 μF DDESAT + – VF VDD2 = 15 V + Q1 VCE Rg – Q2 9 3-Phase Output + VCE – *Pin 8 (VLED1-) is internally connected to pin 4 (GND1). Figure 55.
PAGE 25
threshold voltage (VDESAT), and DESAT charge current (ICHG) as: A pair of PMOS and NMOS comprise the output driver stage, which facilitates close to rail-to-rail output swing. This feature allows a tight control of gate voltage during on-state and short-circuit condition. The output driver is typically to sink 2 A and source 2 A at room temperature. Due to the low RDS(ON) of the MOSFETs, the power dissipation is reduced as compared to those bipolar-type driver output stages.
PAGE 26
during the initial turn-on activation, LOW-to-HIGH transition at the output of the gate driver only occurs 30 µs after the VDD2 power is applied. VIN– VIN+ VO Figure 57. Input/Output Relationship Normal Operation VIN– Fault Condition Reset 0V 5V VIN+ 0V Blanking Time RESET 7V VDESAT VO FAULT Figure 58. Timing Relationship Among DESAT, FAULT, and RESET VIN– 5V VIN+ 0V VUVLO+ VUVLO– VDD2 – VE VO Figure 59. UVLO for Output Side ©2010 Fairchild Semiconductor Corporation FOD8318 Rev. 1.
PAGE 27
Part Number Package Packing Method FOD8318 SO 16-Pin Tube (50 units per tube) FOD8318R2 SO 16-Pin Tape and Reel (750 units per reel) FOD8318V SO 16-Pin, DIN EN/IEC 60747-5-5 Option Tube (50 units per tube) FOD8318R2V SO 16-Pin, DIN EN/IEC 60747-5-5 Option Tape and Reel (750 units per reel) All packages are lead free per JEDEC: J-STD-020B standard. Marking Information 1 2 3 8318 V D X YY KK 4 6 5 J 8 7 Definitions ©2010 Fairchild Semiconductor Corporation FOD8318 Rev. 1.1.
PAGE 28
FOD8318 — 2.5 A Output Current, IGBT Drive Optocoupler with Active Miller Clamp, Desaturation Detection, and Isolated Fault Sensing Reflow Profile Temperature (°C) TP 260 240 TL 220 200 180 160 140 120 100 80 60 40 20 0 Max. Ramp-up Rate = 3 °C/s Max.
PAGE 29
NOTES: UNLESS OTHERWISE SPECIFIED A) DRAWING REFERS TO JEDEC MS-013, VARIATION AA. B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH AND TIE BAR PROTRUSIONS D) DRAWING CONFORMS TO ASME Y14.5M-1994 E) LAND PATTERN STANDARD: SOIC127P1030X275-16N F) DRAWING FILE NAME: MKT-M16FREV2 Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice.
PAGE 30
P2 t Do E Po F d W W1 Bo Ao K1 P D1 Ko User Direction of Feed Symbol W Description Dimmension in mm Tape Width 24.00 ± 0.30 Tape Thickness 0.30 ± 0.05 Po Sprocket Hole Pitch 4.00 ± 0.10 Do Sprocket Hole Diameter D1 Pocket Hole Diameter 1.50 Min E Sprocket Hole Location 1.75 ± 0.10 F Pocket Location 11.50 ± 0.10 P Pocket Pitch 16.00 ± 0.10 Ao Pocket Dimension 11.10 ± 0.10 t 1.50 + 0.10 / -0 P2 2.00 ± 0.10 Bo 11.00 ± 0.10 Ko 3.20 ± 0.10 K1 2.70 ± 0.
PAGE 31
FOD8318 — 2.5 A Output Current, IGBT Drive Optocoupler with Active Miller Clamp, Desaturation Detection, and Isolated Fault Sensing 31 www.fairchildsemi.com ©2010 Fairchild Semiconductor Corporation FOD8318 Rev. 1.1.