Datasheet

©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD852 Rev. 1.2.2 7
FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler
Lead Free Recommended IR Reflow Condition
Figure 16. Reflow Profile
Recommended Wave Soldering Condition
Profile Feature Pb-Sn solder assembly Lead Free assembly
Preheat Conditions
Temperature: T
smin
to T
smax
Time: t
S
100°C to 150°C
60 to 120 seconds
150°C to 200°C
60 to 120 seconds
Melt Soldering Zone 183°C
60 to 120 seconds
217°C
30 to 90 seconds
Peak Temperature (T
p
) 240 +0°C/-5°C 260 +0°C/-5°C
Ramp-down Rate 6°C/s maximum 6°C/s maximum
Profile Feature For all Solder Assembly
Peak Temperature (T
p
) Maximum 260°C for 10 seconds
Time (sec)
t
S
(Preheat)
25°C
Temperature (°C)
T
smin
T
smax
T
p
Soldering zone
Ramp-down