Datasheet

March 2014
FQA8N100C N-Channel QFET
®
MOSFET
©2005 Fairchild Semiconductor Corporation
FQA8N100C Rev C1
www.fairchildsemi.com
1
FQA8N100C
N-Channel QFET
®
MOSFET
1000 V, 8 A, 1.45 Ω
Features
R
DS(on)
= 1.45 Ω (Max.) @ V
GS
= 10 V, I
D
= 4 A
Low Gate Charge (Typ. 53 nC)
Low Crss (Typ. 16 pF)
100% Avalanche Tested
Description
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild's proprietary, planar
stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the avalanche
and commutation mode. These devices are well suited for high
efficient switched mode power supplies.
Absolute Maximum Ratings
T
C
= 25°C unless otherwise noted.
TO-3PN
G
D
S
G
S
D
Thermal Characteristics
Symbol Parameter FQA8N100C Unit
V
DSS
Drain-Source Voltage 1000 V
I
D
Drain Current - Continuous (T
C
= 25°C)
- Continuous (T
C
= 100°C)
8
5
A
A
I
DM
Drain Current - Pulsed
(Note 1)
32 A
V
GSS
Gate-Source voltage ±30 V
E
AS
Single Pulsed Avalanche Energy
(Note 2)
850 mJ
I
AR
Avalanche Current
(Note 1)
A8
E
AR
Repetitive Avalanche Energy
(Note 1)
22.5 mJ
dv/dt Peak Diode Recovery dv/dt
(Note 3)
4.0 V/ns
P
D
Power Dissipation (T
C
= 25°C)
- Derate above 25°C
225
1.79
W
W/°C
T
J,
T
STG
Operating and Storage Temperature Range -55 to +150 °C
T
L
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
300 °C
Symbol Parameter Unit
R
θJC
Thermal Resistance, Junction-to-Case, Max.
0.56 °C/W
R
θCS
Thermal Resistance, Case-to-Sink, Typ.
0.24 °C/W
R
θJA
Thermal Resistance, Junction-to-Ambient, Max.
40 °C/W
FQA8N100C

Summary of content (8 pages)