Datasheet

November 2013
FQD19N10L
N-Channel QFET
®
MOSFET
100 V, 15.6 A, 100 mΩ
Description
FQD19N10L N-Channel QFET
®
MOSFET
©2000 Fairchild Semiconductor Corporation
FQD19N10L Rev. C1
www.fairchildsemi.com
1
This N-Channel enhancement mode power MOSFET is
produced using Fairchild Semiconductor’s proprietary
planar stripe and DMOS technology. This advanced
MOSFET technology has been especially tailored to
reduce on-state resistance, and to provide superior
switching performance and high avalanche energy
strength. These devices are suitable for switched mode
power supplies, audio amplifier, DC motor control, and
variable switching power applications.
Features
Absolute Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter
FQD19N10LTM
Unit
R
JC
Thermal Resistance, Junction to Case, Max.
2.5
o
C/W
R
JA
Thermal Resistance, J
unction to Ambi
ent (
M
inimum
P
ad
of 2
-
oz C
opper),
Max.
110
Thermal Resistance, Junction to Ambient (*1 in
2
Pad of 2-oz Copper), Max.
50
D-PAK
G
S
D
G
S
D
15.6 A, 100 V, R
DS(on)
= 100 mΩ (Max.) @ V
GS
= 10 V
Low Gate Charge (Typ. 14 nC)
Low Crss (Typ. 35 pF)
100% Avalanche Tested
Symbol Parameter
FQD19N10LTM
Unit
V
DSS
Drain-Source Voltage 100 V
I
D
Drain Current
- Continuous (T
C
= 25°C)
15.6 A
- Continuous (T
C
= 100°C)
9.8 A
I
DM
Drain Current - Pulsed
(Note 1)
62.4 A
V
GSS
Gate-Source Voltage ± 20 V
E
AS
Single Pulsed Avalanche Energy
(Note 2)
220 mJ
I
AR
Avalanche Current
(Note 1)
15.6 A
E
AR
Repetitive Avalanche Energy
(Note 1)
5.0 mJ
dv/dt Peak Diode Recovery dv/dt
(Note 3)
6.0 V/ns
P
D
Power Dissipation (T
A
= 25°C) *
2.5 W
Power Dissipation (T
C
= 25°C)
50 W
- Derate Above 25°C
0.4 W/°C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150 °C
T
L
Maximum Lead Temperature for Soldering,
1/8" from Case for 5 Seconds
300 °C

Summary of content (8 pages)