Datasheet

©2008 Fairchild Semiconductor International Rev. A3, October 2008
FQD7N20L / FQU7N20L
FQD7N20L / FQU7N20L
200V LOGIC N-Channel MOSFET
General Description
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology is especially tailored to minimize
on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation modes. These devices are
well suited for high efficiency switching DC/DC converters,
switch mode power supplies, and motor control.
Features
5.5A, 200V, R
DS(on)
= 0.75 @V
GS
= 10 V
Low gate charge ( typical 6.8 nC)
Low Crss ( typical 8.5 pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
Low level gate drive requirement allowing direct
operation from logic drivers
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S
D
G
I-PAK
FQU Series
D-PAK
FQD Series
G
S
D
G
S
D
Absolute Maximum Ratings T
C
= 25°C unless otherwise noted
Thermal Characteristics
Symbol Parameter FQD7N20L / FQU7N20L Units
V
DSS
Drain-Source Voltage 200 V
I
D
Drain Current
- Continuous (T
C
= 25°C)
5.5 A
- Continuous (T
C
= 100°C)
3.48 A
I
DM
Drain Current - Pulsed
(Note 1)
22 A
V
GSS
Gate-Source Voltage ± 20 V
E
AS
Single Pulsed Avalanche Energy
(Note 2)
73 mJ
I
AR
Avalanche Current
(Note 1)
5.5 A
E
AR
Repetitive Avalanche Energy
(Note 1)
4.5 mJ
dv/dt Peak Diode Recovery dv/dt
(Note 3)
5.5 V/ns
P
D
Power Dissipation (T
A
= 25°C) *
2.5 W
Power Dissipation (T
C
= 25°C)
45 W
- Derate above 25°C 0.36 W/°C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150 °C
T
L
Maximum lead temperature for soldering purposes,
1/8 from case for 5 seconds
300 °C
Symbol Parameter Typ Max Units
R
θJC
Thermal Resistance, Junction-to-Case -- 2.78 °C/W
R
θJA
Thermal Resistance, Junction-to-Ambient * -- 50 °C/W
R
θJA
Thermal Resistance, Junction-to-Ambient -- 110 °C/W
* When mounted on the minimum pad size recommended (PCB Mount)
October 2008
QFET
®
RoHS Compliant

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