Datasheet

October 2013
FQP45N15V2 / FQPF45N15V2
N-Channel QFET
®
MOSFET
150 V, 45 A, 40 mΩ
Description
FQP45N15V2 / FQPF45N15V2 — N-Channel QFET
®
MOSFET
©2004 Fairchild Semiconductor Corporation
FQP45N15V2 / FQPF45N15V2 Rev. C1
www.fairchildsemi.com
1
Features
Absolute Maximum Ratings T
C
= 25
o
C unless otherwise noted.
TO-220
G
D
S
TO-220F
G
D
S
G
S
D
This N-Channel enhancement mode power MOSFET is
produced using Fairchild Semiconductor’s proprietary
planar stripe and DMOS technology. This advanced
MOSFET technology has been especially tailored to
reduce on-state resistance, and to provide superior
switching performance and high avalanche energy
strength. These devices are suitable for switched mode
power supplies, audio amplifier, DC motor control, and
variable switching power applications.
• 45 A, 150 V, R
DS(on)
= 40 mΩ (Max.) @ V
GS
= 10 V,
I
D
= 22.5 A
• Low Gate Charge (Typ. 72 nC)
• Low Crss (Typ. 135 pF)
• 100% Avalanche Tested
* Drain current limited by maximum junction temperature
Thermal Characteristics
Symbol Parameter FQP45N15V2 FQPF45N15V2
Unit
V
DSS
Drain-Source Voltage 150 V
I
D
Drain Current
- Continuous (T
C
= 25°C)
45 45 * A
- Continuous (T
C
= 100°C)
31 31 * A
I
DM
Drain Current - Pulsed
(Note 1)
180 180 * A
V
GSS
Gate-Source Voltage ± 30 V
E
AS
Single Pulsed Avalanche Energy
(Note 2)
1124 mJ
I
AR
Avalanche Current
(Note 1)
45 A
E
AR
Repetitive Avalanche Energy
(Note 1)
22 mJ
dv/dt Peak Diode Recovery dv/dt
(Note 3)
4.5 V/ns
P
D
Power Dissipation (T
C
= 25°C)
220 66 W
- Derate above 25°C 1.47 0.44 W/°C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150 °C
T
L
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300 °C
Symbol Parameter FQP45N15V2 FQPF45N15V2
Unit
R
θJC
Thermal Resistance, Junction-to-Case, Max.
0.68 2.25 °C/W
R
θCS
Thermal Resistance, Case-to-Sink, Typ.
0.5 -- °C/W
R
θJA
Thermal Resistance, Junction-to-Ambient, Max.
62.5 62.5 °C/W