Datasheet
November 2013
FQD2N60C / FQU2N60C — N-Channel QFET
®
MOSFET
©2003 Fairchild Semiconductor Corporation
FQD2N60C / FQU2N60C Rev. C1
www.fairchildsemi.com
1
Absolute Maximum Ratings T
C
= 25°C unless otherwise noted.
Thermal Characteristics
Symbol Parameter FQD2N60CTM / FQU2N60CTU Unit
V
DSS
Drain-Source Voltage
600 V
I
D
Drain Current
- Continuous (T
C
= 25°C)
1.9 A
- Continuous (T
C
= 100°C)
1.14 A
I
DM
Drain Current - Pulsed
(Note 1)
7.6 A
V
GSS
Gate-Source Voltage
± 30 V
E
AS
Single Pulsed Avalanche Energy
(Note 2)
120 mJ
I
AR
Avalanche Current
(Note 1)
1.9 A
E
AR
Repetitive Avalanche Energy
(Note 1)
4.4 mJ
dv/dt Peak Diode Recovery dv/dt
(Note 3)
4.5 V/ns
P
D
Power Dissipation (T
A
= 25°C)*
2.5 W
Power Dissipation (T
C
= 25°C)
44 W
- Derate above 25°C
0.35 W/°C
T
J
, T
STG
Operating and Storage Temperature Range
-55 to +150 °C
T
L
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300 °C
Symbol Parameter
FQD2N60CTM /
FQU2N60CTU
Unit
R
θJC
Thermal Resistance, Junction-to-Case, Max. 2.56
°C/W
R
θJA
Thermal Resistance, Junction-to-Ambient (minimum pad of 2 oz copper), Max. 110
Thermal Resistance, Junction-to-Ambient (* 1 in
2
pad of 2 oz copper), Max.
50
FQD2N60C / FQU2N60C
N-Channel QFET
®
MOSFET
600 V, 1.9 A, 4.7 Ω
Features
• 1.9 A, 600 V, R
DS(on)
= 4.7 (Max.) @ V
GS
= 10 V,
I
D
= 0.95 A
• Low Gate Charge (Typ. 8.5 nC)
• Low Crss (Typ. 4.3 pF)
• 100% Avalanche Tested
•RoHS Compliant
Description
This N-Channel enhancement mode power MOSFET is
produced using Fairchild Semiconductor’s proprietary
planar stripe and DMOS technology. This advanced
MOSFET technology has been especially tailored to reduce
on-state resistance, and to provide superior switching
performance and high avalanche energy strength. These
devices are suitable for switched mode power supplies,
active power factor correction (PFC), and electronic lamp
ballasts.
G
D
S
I-PAK
D-PAK
G
S
D
G
S
D