Datasheet

0.50
4.40
1.40 MIN
0.30
3.00 ±0.10
3.00 ±0.10
4.90
0.381
2.45
PIN #1 ID
QUADRANT
A
B
1.10 MAX
0.50
0.27
0.17
0.85 ±0.10
0.15
0.00
.08
M
A B C
0.10 C
C
0.23
0.08
A
12°
TOP & BOTTOM
R 0.13 TYP
0.95
0.22
4°
-8
0.80
0.40
DETAIL A
SCALE 20 : 1
GAUGE
PLANE
SEATING
PLANE
NOTES: UNLESS OTHERWISE SPECIFIED
A. THIS PACKAGE CONFORMS TO JEDEC MO-187
VARIATION BA.
B. ALL DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR EXTRUSIONS.
D. DIMENSIONS AND TOLERANCES AS PER ASME
Y14.5-1994.
E. LAND PATTERN AS PER IPC7351#SOP50P490X110-10AN
F. FILE NAME: MKT-MUA10AREV3
51
LAND PATTERN RECOMMENDATION
TOP VIEW
SIDE VIEW
END VIEW
ALL LEAD TIPS
1 5
10 6
DRAWING NUMBER
10LD, MSOP, JEDEC
MKT-MUA10A
APPROVED:
BOBOY MALDO
BY HUANG
HOWARD ALLEN
CHECKED:
DRAWN:
PROJECTION
INCH
[MM]
APPROVALS
FORMERLY:
SCALE
DATE
24SEP09
SIZE
N/A
SHEET :
1 OF 1
REV
THIS DRAWING IS THE PROPERTY OF FAIRCHILD SEMICONDUCTOR CORPORATION. NO USE
THEREOF SHALL BE MADE OTHER THAN AS A REFERENCE FOR PROPOSALS AS SUBMITTED
TO FAIRCHILD SEMICONDUCTOR CORPORATION FOR JOBS TO BE EXECUTED IN CONFORMITY
WITH SUCH PROPOSALS UNLESS THE CONSENT OF SAID FAIRCHILD SEMICONDUCTOR COR-
COPIED OR DUPLICATED OR ITS CONTENTS DISCLOSED. THE INFORMATION CONTAINED
PORATION HAS PREVIOUSLY BEEN OBTAINED. NO PART OF THIS DRAWING SHALL BE
ON THIS DRAWING IS CONFIDENTIAL AND PROPRIETARY.
NBR
DESCRIPTION
REVISIONS
DATE BY/APP'D
KH LEE
1:1
N/A
APPROVED:
REDREW FORMER NSC DWG
H.ALLEN 07JUN2006
B
3
MO-187, 3.0MM WIDE
.
2
* REMOVE SITE ADDRESS AND CHANGE REVISION
TO NUMERICAL & CHANGED LAND PATTERN TO IPC.
* CHANGE LEAD WIDTH FROM 0.27MAX TO 0.33MAX.
* REMOVE DATE OF JEDEC REVISION
KHLEE/FSSZ 20AUG2009
* REVERT LEAD WIDTH TO 0.27MAX.
KHLEE/FSSZ 24SEP2009 3