Datasheet

©2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
HMHAA280 Rev. 1.1.1 8
HMHAA280 — AC Input, Half Pitch Mini-Flat Package 4-Pin Optocoupler
Footprint Drawing for PCB Layout
Reflow Profile0
0.024
(
0.61
)
0.060
(
1.52
)
0.310
(
7.87
)
0.190
(
4.83
)
0.050
(
1.27
)
(Heating)
to 30 s
180°C
to 60 s
150 s 90 s 80 s
Time (s)
Package Surface Temperature T (°C)
230°C (peak temperature)
210°C
• Peak reflow temperature: 230°C (package surface temperature) for 30 seconds
• Time of temperature higher than 210°C: 60 seconds or less
• One time soldering reflow is recommended