Datasheet

©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com
MID400 Rev. 1.0.4 10
MID400 — AC Line Monitor Logic-Out Device
Carrier Tape Specifications (“D” Taping Orientation)
Reflow Profile
Carrie
Note:
All dimensions are in inches (millimeters)
4.0 ± 0.1
Ø1.55 ± 0.05
User Direction of Feed
4.0 ± 0.1
1.75 ± 0.10
7.5 ± 0.1
16.0 ± 0.3
12.0 ± 0.1
0.30 ± 0.05
13.2 ± 0.2
4.90 ± 0.20
0.1 MAX
10.30 ± 0.20
10.30 ± 0.20
Ø1.6 ± 0.1
215°C, 10–30 s
225 C peak
Time (Minute)
0
300
250
200
150
100
50
0
0.5 1 1.5 2 2.5 3 3.5 4 4.5
Te mperature (°C)
Time above 183° C, 60–150 sec
Ramp up = 3
C/sec
• Peak reflow temperature: 225° C (package surface temperature)
• Time of temperature higher than 183° C for 60–150 seconds
• One time soldering reflow is recommended