Datasheet
©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com
MID400 Rev. 1.0.4 8
MID400 — AC Line Monitor Logic-Out Device
Package Dimensions
Through Hole
Surface Mount
Note:
All dimensions are in inches (millimeters)
0.4" Lead Spacing
8-Pin DIP – Land Pattern
0.200 (5.08)
0.140 (3.55)
0.100 (2.54) TYP
0.022 (0.56)
0.016 (0.41)
0.020 (0.51) MIN
0.390 (9.91)
0.370 (9.40)
0.270 (6.86)
0.250 (6.35)
3
0.070 (1.78)
0.045 (1.14)
241
56 7
8
0.300 (7.62)
TYP
0.154 (3.90)
0.120 (3.05)
0.016 (0.40)
0.008 (0.20)
15° MAX
PIN 1
ID.
SEATING PLANE
Lead Coplanarity : 0.004 (0.10) MAX
0.270 (6.86)
0.250 (6.35)
0.390 (9.91)
0.370 (9.40)
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
0.020 (0.51)
MIN
0.070 (1.78)
0.045 (1.14)
0.300 (7.62)
TYP
0.405 (10.30)
MAX.
0.315 (8.00)
MIN
0.045 (1.14)
32 14
567
8
0.016 (0.41)
0.008 (0.20)
PIN 1
ID.
0.200 (5.08)
0.140 (3.55)
0.100 (2.54) TYP
0.022 (0.56)
0.016 (0.41)
0.004 (0.10) MIN
0.390 (9.91)
0.370 (9.40)
0.270 (6.86)
0.250 (6.35)
3
0.070 (1.78)
0.045 (1.14)
241
56 7
8
0.400 (10.16)
TYP
0.154 (3.90)
0.120 (3.05)
0.016 (0.40)
0.008 (0.20)
0° to 15°
PIN 1
ID.
SEATING PLANE
0.070 (1.78)
0.060 (1.52)
0.030 (0.76)
0.100 (2.54)
0.295 (7.49)
0.415 (10.54)