Datasheet

ManualsBrandsFAIRCHILD SEMICONDUCTOR ManualsBJTs & IGBTsTransistor

www.fairchildsemi.com

February 2006

MPSA56/MMBTA56/PZTA56 Rev. 1.0.2

MPSA56/MMBTA56/PZTA56 PNP General Purpose Ampliﬁer

MPSA56/MMBTA56/PZTA56

PNP General Purpose Ampliﬁer

Description

This device is designed for general purpose ampliﬁer

applications at collector currents to 300mA. Sourced

from Process 73

Absolute Maximum Ratings*

= 25

C unless otherwise speciﬁed.

*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.

Notes:

1. These ratings are based on a maximum junction temperature of 150°C.

2. These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.

3. All voltages (V) and currents (A) are negative polarity for PNP transistors.

Thermal Characteristics

= 25°C unless otherwise noted.

*Device mounted on FR-4 PCB 1.6" x 1.6" x 0.06."

**Device mounted on FR-4 PCB 36mm x 18mm x 1.5mm; mounting pad for the collector lead min. 6 cm

Packages

Parameter Symbol Value Unit

Collector-Emitter Voltage V

CES

-80 V

Collector-Base Voltage V

CBO

-80 V

Emitter-Base Voltage V

EBO

-4.0 V

Collector Current – Continuous I

-500 mA

Operating and Storage Junction Temperature Range T

, T

STG

-55 to +150

Characteristic Symbol

Max

UnitsMPSA56 *MMBTA56 **PZTA56

Total Device Dissipation,

Derate above 25°C

625

5.0

350

2.8

1,000

8.0

mW/°C

Thermal Resistance, Junction to Case R

83.3 °C/W

Thermal Resistance, Junction to Ambient R

200 357 125 °C/W

TO-92

MPSA56 MMBTA56 PZTA56

SOT-23

Mark: 2G

SOT-223

Summary of content (15 pages)

PAGE 1
MPSA56/MMBTA56/PZTA56 PNP General Purpose Amplifier Description This device is designed for general purpose amplifier applications at collector currents to 300mA. Sourced from Process 73 Absolute Maximum Ratings* TA = 25°C unless otherwise specified. Parameter Symbol Value Unit Collector-Emitter Voltage VCES -80 V Collector-Base Voltage VCBO -80 V Emitter-Base Voltage VEBO -4.
PAGE 2
TA = 25°C unless otherwise specified. Parameter Symbol Test Condition Min. Max. Units OFF CHARACTERISTICS Collector-Emitter Breakdown Voltage* V(BR)CEO IC = -1.0mA, IB = 0 -80 V Collector-Base Breakdown Voltage V(BR)CBO IC = -100µA, IE = 0 -80 V Emitter-Base Breakdown Voltage V(BR)EBO IE = -100µA, IC = 0 -4.0 V Collector-Cutoff Current ICEO VCE = -60V, IB = 0 -0.1 µA Collector-Cutoff Current ICBO VCB = -80V, IE = 0 -0.1 µA hFE IC = -10mA, VCE = -1.0V IC = -100mA, VCE = -1.
PAGE 3
MPSA56/MMBTA56/PZTA56 PNP General Purpose Amplifier Typical Characteristics 300 VCE = -1V 250 125°C 200 150 25°C 100 - 40°C 50 FE - h V CESAT - COLLECTOR EMITTE R VOLTAGE (V) TYP ICAL PULSED CURRE NT GAIN Typical Pulsed Current Gain vs Collector Curren -0.001 -0.01 -0.1 I C - COLLECTOR CURRENT (A) -1 -1.2 V BE( ON)- BAS E EMITTER ON VOLTAGE (V) V BESAT - BASE EM ITTE R VOLTAGE (V) Base-Emitter Saturation Voltage vs Collector Current β = 10 -1 - 40°C -0.8 25°C 125°C -0.6 -0.
PAGE 4
f T - GAIN BANDWIDTH PRODUCT (MHz) V CE - COLLECTOR-EMITTER VOLTAGE (V) Gain Bandwidth Product vs Collector Current Collector Saturation Region -10 TA = 25°C -8 -6 I= -1mA -100mA -10mA -4 -2 0 -3000 -5000 -10000 -20000 -30000 -50000 350 V CE = -5V 300 250 200 150 100 50 0 -1 -10 -100 IC - COLLECTOR CURRENT (mA) I B - BASE CURRENT (µA) Power Dissipation vs Ambient Temperature P D - POWER DISSIPATION (W) 1 SOT-223 0.75 TO-92 0.5 SOT-23 0.
PAGE 5
TO-92 Packaging Configuration: Figure 1.0 TAPE and REEL OPTION FSCINT Label sample FAIRCHILD SEMICONDUCTOR CORPORATION LOT: CBVK741B019 PN2222N NSID: D/C1: QTY: See Fig 2.
PAGE 6
TO-92 Reeling Style Configuration: Figure 2.0 Machine Option “A” (H) Machine Option “E” (J) Style “A”, D26Z, D70Z (s/h) Style “E”, D27Z, D71Z (s/h) TO-92 Radial Ammo Packaging Configuration: Figure 3.0 FIRST WIRE OFF IS COLLECTOR ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON TOP ORDER STYLE D74Z (M) ORDER STYLE D75Z (P) FIRST WIRE OFF IS COLLECTOR (ON PKG. 92) ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON TOP FIRST WIRE OFF IS EMITTER (ON PKG.
PAGE 7
TO-92 Tape and Reel Taping Dimension Configuration: Figure 4.0 Hd P Pd b Ha W1 d L H1 HO L1 S WO t W2 W t1 P1 F1 DO P2 PO User Direction of Feed TO-92 Reel Configuration: Figure 5.0 ITEM DESCRIPTION SYMBOL DIMENSION Base of Package to Lead Bend b 0.098 (max) Component Height Ha 0.928 (+/- 0.025) Lead Clinch Height HO 0.630 (+/- 0.020) Component Base Height H1 0.748 (+/- 0.020) Component Alignment ( side/side ) Pd 0.040 (max) Component Alignment ( front/back ) Hd 0.
PAGE 8
MPSA56/MMBTA56/PZTA56 PNP General Purpose Amplifier TO-92 Package Dimensions TO-92 (FS PKG Code 92, 94, 96) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.1977 8 MPSA56/MMBTA56/PZTA56 Rev. 1.0.2 www.fairchildsemi.
PAGE 9
SOT-23 Packaging Configuration: Figure 1.0 Customized Label Packaging Description: SOT-23 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 3,000 units per 7" or 177cm diameter reel.
PAGE 10
SOT-23 Embossed Carrier Tape Configuration: Figure 3.0 P0 P2 D0 D1 T E1 W F E2 Wc B0 Tc A0 P1 K0 User Direction of Feed Dimensions are in millimeter Pkg type A0 B0 SOT-23 (8mm) 3.15 +/-0.10 2.77 +/-0.10 W 8.0 +/-0.3 D0 D1 E1 E2 1.55 +/-0.05 1.125 +/-0.125 1.75 +/-0.10 F 6.25 min 3.50 +/-0.05 P1 P0 4.0 +/-0.1 4.0 +/-0.1 K0 T 1.30 +/-0.10 0.228 +/-0.
PAGE 11
SOT-23 (FS PKG Code 49) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.0082 11 MPSA56/MMBTA56/PZTA56 Rev. 1.0.2 www.fairchildsemi.
PAGE 12
MPSA56/MMBTA56/PZTA56 PNP General Purpose Amplifier SOT-223 Tape and Reel Data SOT-223 Packaging Configuration: Figure 1.0 Customized Label Packaging Description: F63TNR Label Antistatic Cover Tape SOT-223 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent.
PAGE 13
SOT-223 Embossed Carrier Tape Configuration: Figure 3.0 P0 D0 T E1 F K0 Wc E2 B0 W Tc A0 D1 P1 User Direction of Feed Dimensions are in millimeter Pkg type SOT-223 (12mm) A0 6.83 +/-0.10 B0 7.42 +/-0.10 W 12.0 +/-0.3 D0 D1 1.55 +/-0.05 1.50 +/-0.10 E1 E2 1.75 +/-0.10 F 10.25 min P1 5.50 +/-0.05 P0 8.0 +/-0.1 4.0 +/-0.1 K0 1.88 +/-0.
PAGE 14
SOT-223 (FS PKG Code 47) 1:1 Scale 1:1 on letter size paper Part Weight per unit (gram): 0.1246 14 MPSA56/MMBTA56/PZTA56 Rev. 1.0.2 www.fairchildsemi.
PAGE 15
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ FAST® ActiveArray™ FASTr™ Bottomless™ FPS™ Build it Now™ FRFET™ CoolFET™ GlobalOptoisolator™ CROSSVOLT™ GTO™ DOME™ HiSeC™ EcoSPARK™ I2C™ 2 E CMOS™ i-Lo™ EnSigna™ ImpliedDisconnect™ FACT™ IntelliMAX™ FACT Quiet Series™ Across the board. Around the world.