Datasheet

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QEB363 Subminiature Plastic Infrared Emitting Diode

September 2006

QEB363 Rev. 1.0.0

QEB363

Subminiature Plastic Infrared Emitting Diode

Features

■

T-3/4 (2mm) Surface Mount Package

■

Tape & Reel Option (See Tape & Reel Specifications)

■

Lead Form Options: Gullwing, Yoke, Z-Bend

■

Narrow Emission Angle, 24°

■

Wavelength = 940nm, GaAs

■

Clear Water Lens

■

Matched Photosensor: QSB363

■

High Radiant Intensity

Package Dimensions

0.074 (1.9)

0.008 (0.21)

0.004 (0.11)

0.106 (2.7)

0.091 (2.3)

0.055 (1.4)

0.024 (0.6)

0.016 (0.4)

0.087 (2.2)

0.071 (1.8)

0.019 (0.5)

0.012 (0.3)

0.276 (7.0)

MIN

0.024 (0.6)

.059 (1.5)

.051 (1.3)

.118 (3.0)

.102 (2.6)

ANODE

Notes:

1. Dimensions are in inches (mm).

2. Tolerance of ±.010 (.25) on all non nominal dimensions unless otherwise specified.

Schematic

Summary of content (5 pages)

PAGE 1
QEB363 Subminiature Plastic Infrared Emitting Diode tm Features ■ T-3/4 (2mm) Surface Mount Package ■ Tape & Reel Option (See Tape & Reel Specifications) ■ Lead Form Options: Gullwing, Yoke, Z-Bend ■ Narrow Emission Angle, 24° ■ Wavelength = 940nm, GaAs ■ Clear Water Lens ■ Matched Photosensor: QSB363 ■ High Radiant Intensity Package Dimensions ANODE 0.276 (7.0) MIN 0.087 (2.2) 0.071 (1.8) 0.024 (0.6) 0.016 (0.4) 0.019 (0.5) 0.012 (0.3) 0.074 (1.9) Schematic .118 (3.0) .102 (2.6) .059 (1.5) .051 (1.
PAGE 2
Symbol Parameter TOPR Operating Temperature TSTG Storage Temperature Rating Unit -40 to +100 °C -40 to +100 °C TSOL-I Soldering Temperature (Iron)(2,3,4) 240 for 5 sec °C TSOL-F Soldering Temperature (Flow)(2,3) 260 for 10 sec °C IF Continuous Forward Current 50 mA VR Reverse Voltage 5 V 100 mW PD Power Dissipation(1) Notes: 1. Derate power dissipation linearly 1.33mW/°C above 25°C. 2. RMA flux is recommended. 3.
PAGE 3
Fig. 2 Relative Radiant Intensity vs. Wavelength Fig. 1 Maximum Forward Current vs. Temperature 100 IF = 20 mA TA = 25˚C Relative Radiant Intensity (%) Forward Current IF (mA) 200 160 120 80 40 0 -25 0 25 50 75 85 80 60 40 20 100 0 880 900 920 940 960 980 1000 1020 1040 Ambient Temperature TA (˚C) Wavelength λ (nm) Fig. 4 Forward Current vs. Forward Voltage 500 980 Forward Current IF (mA) Peak Emission Wavelength (nm) Fig. 3 Peak Emission Wavelength vs.
PAGE 4
Features ■ Three lead forming options: Gull Wing, Yoke and Z-Bend ■ Compatible with automatic placement equipment ■ Supplied on tape and reel or in bulk packaging ■ Compatible with vapor phase reflow solder processes Gull Wing Lead Configuration Yoke Lead Configuration 0.283 (7.2) 0.166 (4.2) 0.098 (2.5) 0.016 (0.4) 0.016 (0.4) ANODE 0.020 (0.51) ANODE 0.020 (0.5) 0.087 (2.2) 0.071 (1.8) 0.087 (2.2) 0.071 (1.8) 0.074 (1.9) 0.074 (1.9) 0.024 (0.6) .118 (3.0) .102 (2.6) 0.118 (3.0) 0.102 (2.6) 0.
PAGE 5
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