Datasheet

ManualsBrandsFAIRCHILD SEMICONDUCTOR ManualsPhotoelectric SensorsQRE1113

QRE1113, QRE1113GR — Minature Reﬂective Object Sensor

QRE1113, QRE1113GR Rev. 1.7.1

August 2011

QRE1113, QRE1113GR

Minature Reﬂective Object Sensor

Features

■

Phototransistor output

■

No contact surface sensing

■

Miniature package

■

Lead form style: Gull Wing

■

Two leadform options: Through hole (QRE1113)

SMT gullwing (QRE1113GR)

■

Two packaging options: Tube (QRE1113)

Tape and reel (QRE1113GR)

QRE1113GR Package Dimensions

2.90

2.50

3.60

0.94

3.20

1.80

0.60

1.00

0.40

0.94

1.70

1.50

4.80

4.40

1.10

0.90

1 2

30°

0.40

Notes:

1. Dimensions for all drawings are in millimeters.

2. Tolerance of ±0.15mm on all non-nominal dimensions

0.120

Summary of content (8 pages)

PAGE 1
QRE1113, QRE1113GR Minature Reflective Object Sensor Features ■ Phototransistor output ■ Two leadform options: Through hole (QRE1113) SMT gullwing (QRE1113GR) ■ No contact surface sensing ■ Two packaging options: Tube (QRE1113) ■ Miniature package Tape and reel (QRE1113GR) ■ Lead form style: Gull Wing QRE1113GR Package Dimensions 2.90 2.50 0.60 0.40 1.00 3 4 0.94 CL 3.60 3.20 1.80 CL 0.94 1 2 30° 0.40 1.70 0.120 1.50 1.10 0.90 4.80 4.40 Notes: 1.
PAGE 2
QRE1113, QRE1113GR — Minature Reflective Object Sensor QRE1113 Package Dimensions 2.90 2.50 0.60 0.40 1.00 4 3 0.94 CL 3.60 3.20 1.80 CL 0.94 1 2 4.20 3.80 0.40 1.70 1.50 10.4 8.4 0~20° 0~20° Notes: 1. Dimensions for all drawings are in millimeters. 2. Tolerance of ±0.15mm on all non-nominal dimensions Schematic 1 2 3 Pin 1: Anode Pin 2: Cathode ©2011 Fairchild Semiconductor Corporation QRE1113, QRE1113GR Rev. 1.7.1 4 Pin 3: Collector Pin 4: Emitter www.fairchildsemi.
PAGE 3
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.
PAGE 4
1.0 IF = 10 mA VCE = 5 V TA = 25˚C 0.8 IC (ON) - COLLECTOR CURRENT (mA) IC (ON)- NORMALIZED COLLECTOR CURRENT 1.0 d 0 0.6 0.4 Sensing Object: White Paper (90% reflective) 0.2 Mirror 0.0 0 1 2 3 4 0.8 0.6 0.4 0.2 0.0 5 0 d-DISTANCE (mm) ICEO - NORMALIZED DARK CURRENT IC (ON) - NORMALIZED COLLECTOR CURRENT d = 1 mm, 90% reflection TA = 25˚C 1.6 IF = 25mA 1.2 IF =20mA 1.0 0.8 IF =15mA 0.6 IF =10mA 0.4 IF =5mA 0.2 0.0 0.
PAGE 5
100 VCC = 10 V tpw = 100 us T=1ms TA = 25˚C TA = 25˚C 40 RISE AND FALL TIME (us) IF - FORWARD CURRENT (mA) 50 30 20 10 0 1.0 1.1 1.2 1.3 1.4 tf IC = 0.3 mA tr 10 tf tr IC = 1 mA 1 0.1 1.5 1 VF - FORWARD VOLTAGE (V) 10 RL - LOAD RESISTANCE (KΩ) Fig. 7 Rise and Fall Time vs. Load Resistance Fig. 6 Forward Current vs. Forward Voltage 2.5 RELATIVE RADIANT INTENSITY VF - FORWARD VOLTAGE (V) 3.0 2.0 IF = 50 mA 1.5 IF = 20 mA IF = 10 mA 1.0 0.5 0.0 -40 -20 0 20 40 60 0.9 0.
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QRE1113, QRE1113GR — Minature Reflective Object Sensor Recommended Solder Screen Pattern for GR option (for reference only) 1.1 LED (+) 1.0 0.8 2.8 Dimensions in mm Taping Dimensions for GR option Progressive Direction 2.0±0.05 4.0 ø1.5 0.25 1.75 5.5±0.05 12.0±0.3 4.75 3.73 8.0 1.98 General tolerance ±0.1 Dimensions in mm ©2011 Fairchild Semiconductor Corporation QRE1113, QRE1113GR Rev. 1.7.1 www.fairchildsemi.
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2.2 ± 0.5 ø178.0 ± 1.0 ø60.0 ± 0.5 ø13.0 ± 0.5 9.0 ± 0.5 12.0 ± 0.15 Reflow Profile 260°C max. for 10 sec. max. 1°C to 5°C/sec Temperature (°C) 260°C Pre-heating 180°C to 200°C 1°C to 5°C/sec 220°C 60 sec. max. above 220°C 120 sec. max. Time (seconds) Note: Reflow soldering should not be done more than twice. ©2011 Fairchild Semiconductor Corporation QRE1113, QRE1113GR Rev. 1.7.1 www.fairchildsemi.
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