Specifications
BLE 5.1 Modules BM833/F/EVer 0.50 June 2019
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(5) Avoid assembly and use of the target equipment in conditions where the products' temperature
may exceed the maximum tolerance.
(6) The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or
spikes.
(7) this product away from other high frequency circuits.
Notes on Antenna and PCB Layout
(1) Don’t use a module with internal antenna inside a metal case.
(2) For PCB layout:
• Avoid running any signal line below module whenever possible,
• No ground plane below antenna,
• If possible, cut-off the portion of main board PCB below antenna.
Installation Notes
(1) Reflow soldering is possible twice based on the time-temperature profile in this data sheets.Set up
the temperature at the soldering portion of this product according to this reflow profile.
(2) Carefully position the products so that their heat will not burn into printed circuitboards or affect the
other components that are susceptible to heat.
(3) Carefully locate these products so that their temperatures will not increase due tothe effects of
heat generated by neighboring components.
(4) If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate
toxic gas, damaging the insulation. Never allow contact between the cover and these products to
occur.
(5) This product should not be mechanically stressed or vibrated when reflowed.
(6) If you want to repair your board by hand soldering, please keep the conditions of this chapter.
(7) Do not wash this product.
(8) Refer to the recommended pattern when designing a board.
(9) Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the
unit.
Usage Condition Notes
(1)Take measures to protect the unit against static electricity. If pulses or other transient loads (a
large load applied in a short time) are applied to the products, check and evaluate their operation
before assembly on the final products.
(2)Do not use dropped products.
(3)Do not touch, damage or soil the pins.
(4) Follow the recommended condition ratings about the power supply applied to thisproduct.
(5)Electrode peeling strength: Do not add pressure of more than 4.9N when soldered on PCB
(6) Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage.