Data Sheet

FSC-BT1006A Datasheet
Shenzhen Feasycom Technology Co.,Ltdwww.feasycom.com
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solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component
discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The
recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 second when the
temperature is above 217 C.
Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longer-lasting joint.
Typical cooling rate should be 4 C.
8. MECHANICAL DETAILS
8.1 Mechanical Details
 Dimension: 13mm(W) x 26.9mm(L) x 1.8mm(H) Tolerance: ±0.1mm
 Module size: 13mm X 26.9mm Tolerance: ±0.2mm
 Pad size: 1.6mmX0.6mm Tolerance: ±0.2mm
 Pad pitch: 1.0mm Tolerance: ±0.1mm
Figure 20: FSC-BT1006Afootprint