Data Sheet

FSC‐BT646Datasheet
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 ShenzhenFeasycomTechnologyCo.,Ltd   www.feasycom.com
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3 9hours 7hours 33hours 23hours
13days  9days 
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Feasycomsurfacemountmodulesaredesignedtobeeasilymanufactured,includingreflowsolderingtoaPCB.Ultimately
itistheresponsibilityofthecustomertochoosetheappropriatesolderpasteandtoensureoventemperaturesduring
reflowmeettherequirementsofthesolderpaste.FeasycomsurfacemountmodulesconformtoJ‐STD‐020D1standards
forreflowtemperatures.
Thesolderingprofiledependsonvariousparametersnecessitatingasetupforeachapplication.  Thedatahereisgiven
onlyforguidanceonsolderreflow.
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Figure5:TypicalLead‐freeRe‐flow
Pre‐heatzone(A)—Thiszoneraisesthetemperatureatacontrolledrate,typically0.5–2C/s.  Thepurposeofthis
zoneistopreheatthePCBboardandcomponentsto120~150C.  Thisstageisrequiredtodistributetheheatuniformly
tothePCBboardandcompletelyremovesolventtoreducetheheatshocktocomponents. 
EquilibriumZone1(B)—Inthisstagethefluxbecomessoftanduniformlyencapsulatessolderparticlesandspreadover
PCBboard,preventingthemfrombeingre‐oxidized.  Alsowithelevationoftemperatureandliquefactionofflux,each
activatorandrosingetactivatedandstarteliminatingoxidefilmformedonthesurfaceofeachsolderparticleandPCB
board.Thetemperatureisrecommendedtobe150to210for60to120secondforthiszone.
EquilibriumZone2(C)(optional)—Inordertoresolvetheuprightcomponentissue,itisrecommendedtokeepthe
temperaturein210–217forabout20to30second. 
ReflowZone(D)—TheprofileinthefigureisdesignedforSn/Ag3.0/Cu0.5.  Itcanbeareferenceforotherlead‐free
solder.Thepeaktemperatureshouldbehighenoughtoachievegoodwettingbutnotsohighastocausecomponent
discolorationordamage.Excessivesolderingtimecanleadtointermetallicgrowthwhichcanresultinabrittlejoint.The
recommended peak temperature (Tp) is 230 ~ 250 C.  The soldering time should be 30 to 90 second when the
temperatureisabove217C.
CoolingZone(E)—Thecoolingateshouldbefast,tokeepthesoldergrainssmallwhichwillgivealonger‐lastingjoint.
Typicalcoolingrateshouldbe4C.
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