Data Sheet

FSC-BT806BDatasheet
Shenzhen Feasycom Technology Co.,Ltdwww.feasycom.com
-47-
each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and
PCB board. The temperature is recommended to be 150 to 210 for 60 to 120 second for this zone.
Equilibrium Zone 2 (C) (optional) — In order to resolve the upright component issue, it is recommended to keep the
temperature in 210 – 217  for about 20 to 30 second.
Reflow Zone (D) — The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for other lead-free
solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component
discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The
recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 second when the
temperature is above 217 C.
Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longer-lasting joint.
Typical cooling rate should be 4 C.
8. MECHANICAL DETAILS
8.1 Mechanical Details
 Dimension: 13mm(W) x 26.9mm(L) x 2.2mm(H) Tolerance: ±0.1mm
 Module size: 13mm X 26.9mm Tolerance: ±0.2mm
 Pad size: 1.6mmX0.6mm Tolerance: ±0.2mm
 Pad pitch: 1.0mm Tolerance: ±0.1mm
Figure 34: FSC-BT806Bfootprint