Data Sheet

FSC-BT956B Datasheet
Shenzhen Feasycom Technology Co., Ltd www.feasycom.com
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8.2 Host PCB Land Pattern and Antenna Keep-out for FSC-BT956B
Please check the picture below for Pad Structure and Keep Out Area:
Figure 12: Host PCB-Top View
9. HARDWARE INTEGRATION SUGGESTIONS
9.1 Soldering Recommendations
FSC-BT956B is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is
dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of
solder paste used. Consult the datasheet of particular solder paste for profile configurations.
Feasycom will give following recommendations for soldering the module to ensure reliable solder joint and operation of
the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be
studied case by case. Thus following recommendation should be taken as a starting point guide.