Data Sheet

FSC-BT986 Datasheet
Shenzhen Feasycom Technology Co., Ltd www.feasycom.com
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8.2 Host PCB Land Pattern and Antenna Keep-out for FSC-BT986
Please check the picture below for Pad Structure and Keep Out Area:
Figure 8: Host PCB-Top View
9. HARDWARE INTEGRATION SUGGESTIONS
9.1 Soldering Recommendations
FSC-BT986 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent
on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder
paste used. Consult the datasheet of particular solder paste for profile configurations.
Feasycom will give following recommendations for soldering the module to ensure reliable solder joint and operation of
the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be
studied case by case. Thus following recommendation should be taken as a starting point guide.