User's Manual
FreeWings Technologies Co., Ltd
Page 10 of 11
FW3817-30 Bluetooth Audio Module Datasheet V1.5
5 Recommended reflow temperature profile
1)
Follow: IPC/JEDEC J-STD-020 C
2)
Condition:
Average ramp-up rate(217℃ to peak): 1~2℃/sec max.
Preheat: 150~200C, 60~180 seconds
Temperature maintained above 217℃: 20~40 sec
Peak temperature: 250+0/-5℃ or 260+0/-5℃
Ramp-down rate: temperature: 8 minutes max
Cycle interval: 5 minus
The module Must go through 125℃ baking for at least 9 hours before SMT
AND IR reflow process!
若拆封后未立即上线,翼动通讯建议让下次上线前务必以 125℃烘烤 9 小时以上!










