User's Manual
Table Of Contents
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L816-AM Hardware User Manual Page
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42
3.6 GPIO
....................................................................................................................................................
30
3.6.1 FW_Ready........................................................................................................................................ 31
3.6.2 SMS_Ready......................................................................................................................................31
3.6.3 Wakeup_Host...................................................................................................................................31
3.6.4 PA_Blanking..................................................................................................................................... 32
3.7 Interrupt Control................................................................................................................................. 32
3.7.1 W_Disable#...................................................................................................................................... 32
3.7.2 BodySar.............................................................................................................................................33
3.8 Other Interfaces................................................................................................................................. 33
4 RF Interface
................................................................................................................................
34
4.1 Operating Band..................................................................................................................................34
4.2 Transmitting Power............................................................................................................................34
4.3 Receiver Sensitivity
...........................................................................................................................
35
4.4 RF PCB Design..................................................................................................................................36
4.4.1 Trace Routing Principle.................................................................................................................. 36
4.4.2 RF Impedance Design.................................................................................................................... 36
4.5 Antenna Design..................................................................................................................................37
4.5.1 Antenna Design Requirements..................................................................................................... 37
5 Structure Specification
............................................................................................................
38
5.1 Product Appearance..........................................................................................................................38
5.2 Dimension of Structure..................................................................................................................... 39
5.3 Recommended Design for PCB Bonding Pad
..............................................................................
40
5.4 SMT Paster.........................................................................................................................................41
5.5 Storage................................................................................................................................................42
5.5.1 Storage Life...................................................................................................................................... 42
5.5.2 Workshop Life.................................................................................................................................. 42
5.5.3 Recommended baking standards:................................................................................................42
5.6 Packing
................................................................................................................................................
42
5.6.1 Tray Package....................................................................................................................................42