FIBOCOM B830-GL Hardware User Manual HP Customization Draft Version Version: V1.0.0 Date: 2019-09-19 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
Applicability type No. Product model Description 1 B830-GL-02 Draft version Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
Copyright Copyright ©2019 Fibocom Wireless Inc. All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or transmit the document in any form. Attention The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide.
Contents 1 2 3 Preface .......................................................................................................................... 6 1.1 Introduction................................................................................................................... 6 1.2 Reference Standard .......................................................................................................... 6 1.3 Related Documents ....................................................................
Structure Specification .............................................................................................. 24 5.1 Product Appearance ................................................................................................... 24 5.2 Dimension of Structure ............................................................................................... 24 5.3 M.2 Interface Model ....................................................................................................
1 Preface 1.1 Introduction The document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of B830-GL (hereinafter referred to as B830). With the assistance of the document and other instructions, the developers can quickly understand the hardware functions of B830 modules and develop products. 1.2 Reference Standard The design of the product complies with the following standards: Bluetooth Core Specification v5.0 Bluetooth® 5, IEEE 802.15.
2 Overview Introduction 2.1 B830-GL is a BT 5.0 module which uses M.2 form factor interface. 2.2 Specification Specification BT Version 5.0 Power Supply DC 3.135V～3.6V, Typical 3.3V Normal Operating temperature：-10°C ～+55°C Temperature Extended Operating temperature：-30°C ～+65°C Storage temperature：-40°C ～+85°C Interface: M.2 Key B-M Physical Dimension：30 x 42 x 2.3mm characteristics Weight: about 4.
2.3 Warnings 2.3.1 FCC Statement Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users.
This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body. 2.3.3 CE Statement ► EU Regulatory Conformance Hereby, We, Manufacturer name declares that the radio equipment type B830-GL is in compliance with the Directive 2014/53/EU. In all cases assessment of the final product must be mass against the Essential requirements of the Directive 2014/53/EU Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.2 requirements.
Main ANT Module Power Supply BUTTON I2C Host Host Figure2-1 Application Block 2.5 Hardware Block Diagram The hardware block diagram in Figure 2-2 shows the main hardware functions of B830 module, including baseband and RF functions. M.2 Key B-M 75pin interface DCDC BOOST Driver PWM Signal PMU TILE_BUTTON I2C GPIO Flash RAM nRF52840 ANT 32MHz XO Figure 2-2 Hardware Block Diagram Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
3 Application Interface 3.1 M.2 Interface The B830 module uses standard M.2 Key-B-M interface, with a total of 75 pins. 3.1.1 Pin Map Figure 3-1 Pin Map Note: Pin “Notch” represents the gap of the gold fingers. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
3.1.2 Pin Definition The pin definition is as follows: Pin Pin Name I/O Pin Description Type 1 CONFIG_3 O Connected to internal GND 2 +3.3V PI Module main power input. Power Supply 3 GND GND Power Supply 4 +3.3V Module main power input. Power Supply 5 GND GND Power Supply 6 BUTTON Wake up module, Low active 3.3V 7 USB D+ I/O USB 1.1 D+ signal(Reserved) 0.3---3V 8 GPIO2(Reserved) I/O GPIO port(Reserved) 3.3V 9 USB D- I/O USB 1.1 D- signal(Reserved) 0.
Pin Pin Name I/O Pin Description 27 GND GND 28 I2C_INT# 29 NC NC 30 NC NC 31 NC NC 32 NC NC 33 GND GND 34 NC NC 35 NC NC 36 NC NC 37 NC NC 38 NC NC 39 GND GND 40 NC NC 41 NC NC 42 NC NC 43 NC NC 44 NC NC 45 GND GND 46 NC NC 47 NC NC 48 NC NC 49 NC NC 50 NC NC 51 GND GND 52 NC NC 53 NC NC 54 NC NC 55 NC NC Type Power Supply I/O I2C serial data signal, internal 10KΩ pull-up. 3.
Pin Pin Name I/O Pin Description Type 56 NC NC 57 GND GND 58 NC NC 59 Notch Notch 60 Notch Notch 61 Notch Notch 62 Notch Notch 63 Notch Notch 64 Notch Notch 65 Notch Notch 66 Notch Notch 67 NC NC 68 NC NC 69 CONFIG_1 O Connected to internal GND 70 +3.3V PI Module main power input. Power Supply 71 GND GND Power Supply 72 +3.3V Module main power input. Power Supply 73 GND GND Power Supply 74 +3.3V PI Module main power input.
DC Parameter（V） Pin Pin Name 2,4,70,72,74 3.2.1 +3.3V I/O Pin Description PI Power supply input Minimum Typical Maximum Value Value Value 3.135 3.3 3.6 Power Supply The B830 module should be powered through the +3.
Piezo PWM burst Piezo PWM burst Ripple≤300mV Power supply Drop VBAT≥3.135V min:3.135V Figure 3-3 Power Supply Limit 3.2.2 GPIO Logic level The B830 module GPIO logic level definition as shown in the following table: Parameters Minimum Maximum VIH 0.7 x VDD VDD VIL 0V 0.3 x VDD Note: VDD is module power supply. 3.2.3 Power Consumption In the condition of 3.
Parameter Isound Max Typical Mode Condition RMS Max sound 500 TBD Peak Max sound 1200 TBD Current(mA) Current(mA) Note: The data above is an average value obtained by testing some samples. 3.3 Button# B830 provides an interrupt signal use to wake up module, the definition of Button# signal is as follows: Pin Pin Name I/O Pin Description Type 6 Button# I Wake up module, Low active 3.3V 3.
Figure 3-4 I2C Signal Connection Note: I2C interface can be left floating if not used. 3.5 Piezo The B830 has a piezoelectric element that can be used to output simply sounds. nRF52840 pin Pin Name I/O Pin Description P0.08 PIEZO_PWM_NEG O P1.08 PIEZO_PWM_POS O Type Bridge output signal(Phase difference of 180°), output PWM signal to drive piezo buzzer Bridge output signal(Phase difference of 180°), output PWM signal to drive piezo buzzer 3.3V 3.
The volume of piezo on module is about 100dB@Level 4(background noise is lower than 40dB). The sound test environment is as Figure 3-5: Figure 3-5 Sound Test Environment Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
4 Radio Frequency 4.1 RF Interface 4.1.1 RF Interface Functionality The B830 module supports RF connector used for external antenna connection, as the Figure 4-1 shows. Figure 4-1 RF connectors 4.1.2 RF Connector Characteristic Rated Condition Environment Condition Frequency Range DC to 6GHz Temperature Range Characteristic Impedance 50Ω –40°C to +85°C 4.1.3 RF Connector Dimension The B830 module adopts standard M.
Figure 4-2 RF connector dimensions Figure 4-3 0.81mm coaxial antenna dimensions Figure 4-4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
4.2 Operating Mode The B830 module operating mode of the antenna is as follows: Mode Operation Mode Tx (MHz) Rx (MHz) Bluetooth LE 2400 – 2483.5 2400 – 2483.5 4.3 Transmitting Power The transmitting power of the B830 module is as shown in the following table: Mode Operation Mode Bluetooth LE 4.4 BT SIG Requirement Tx Power(dBm) -20≤Power≤10 7.5+2.5/-4.5 Note Receiver Sensitivity The receiver sensitivity of the B830 module is as shown in the following table: Mode BLE 4.
5 Structure Specification 5.1 Product Appearance The product appearance for B830 module is shown in Figure 5-1: Figure 5-1 Module Appearance 5.2 Dimension of Structure The structural dimension of the B830 module is shown in Figure 5-2: Figure 5-2 Dimension of Structure Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
5.3 M.2 Interface Model The B830 M.2 module adopts 75-pin gold finger as external interface, where 59 pins are signal pins and 16 pins are notch pins as shown in Figure7-1. For module dimension, please refer to chapter 7.2 Dimension of Structure. Based on the M.2 interface definition, B830 module adopts Type 3042-S3-B-M interface (30x42mm, the component maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B-M). 5.4 M.2 Connector The B830 module connects to AP via M.
Figure 5-3 M.2 Dimension of Structure 5.5 Storage 5.5.1 Storage Life Storage Conditions (recommended): Temperature is 23 ± 5 ℃, relative humidity is less than RH 60%. Storage period: Under the recommended storage conditions, the storage life is 12 months. 5.6 Packing The B830 module uses the tray sealed packing, combined with the outer packing method using the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to the greatest extent.
Figure 5-4 Tray Packaging Process Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
5.6.2 Tray size The pallet size of B830 serial module is 315*170*6.5mm, as shown in Figure 5-5: Figure 5-5 Tray Size Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
