Hardware Guide
Table Of Contents
- Fibocom_FM101-CG_Hardware_Guide_V1.0.pdf
- FM101-CG-20: Hardware Guide
- Contents
- Change History
- 1. Foreword
- 2. Product Overview
- 3. Pin Definition
- 4. Electrical Characteristics
- 5. Functional Interface
- 6. Radio Frequency
- 6.1. RF Interface
- 6.2. Operating Bands
- 6.3. Transmitting Power
- 6.4. Receiving Sensitivity
- 6.5. GNSS Receiving Performance
- 6.6. Antenna Design
- 6.7. PCB Routing Design
- 6.8. Main Antenna Design
- 6.9. Diversity and MIMO Antenna Design
- 6.10. GNSS Antenna Design
- 6.11. Other Interfaces
- 7. Thermal Design
- 8. Electrostatic Protection
- 9. Structural Specifications
- Appendix A: Acronyms and Abbreviations
- Module FCC & ISED警语 for Fibocom
layer is on Lay 2 (GND layer).
The stacking varies with PCB vendor, the following figure is taken as an example.
Figure 22. Four layers (1+2+1) thickness
Table 32. Four-layer board stacking thickness
Layer Material Thickness (um)
- - Solder Mask - -
Lay 1 0.33OZ+Plating 25
- - PP 1080 65
Lay 2 0.5OZ+Plating 25
- - 0.510 mm (H/H OZ) 508
Lay 3 0.510 mm+Plating 25
- - PP 1080 65
Lay 4 0.33OZ+Plating 25
- - Solder Mask - -
The thickness from Lay 1 to Lay 2 is 65 um, RF trace is 4 mil, and the distance from RF to
GND is greater than 3 times of RF line width.
The blue area is Lay 1 and the red area is Lay 2, the highlighted part is RF line.
6. Radio Frequency
Copyright © Fibocom Wireless Inc. 49