Hardware Guide

Table Of Contents

7. Thermal Design

FM101-CG module is designed to be workable on an extended temperature range, to

make sure the module can work properly for a long time and achieve a better

performance under extreme temperatures or extreme working conditions, such as high

temperatures and high speed data transfer, it is required to add a exposed copper area

at the corresponding motherboard position on the back of the FM101-CG module,

and use a thermal conductive material to connect the module and the motherboard in

this area to ensure that the heat of the module can be released through the

motherboard. The following fogure shows the design.

Other measures to improve heat dissipation performance are as follows:

•

Heat devices and other heat sources on the motherboard are as far away from the

module as possible.

•

The ground plane of the motherboard under the module is as complete as possible,

and as many ground holes are drilled as possible to increase heat dissipation

capability.

•

Use screws to secure the module and motherboard to ensure good contact

between the motherboard and the module.

•

The use of heat sinks above the module is preferred, followed by the motherboard

below the module.

7. Thermal Design