FIBOCOM FM150-NA Hardware User Manual Version: V1.0.
Applicability Table No. 1 Product model Description FM150-NA 5G communication module with M.2 interface Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
Copyright Copyright © 2020 Fibocom Wireless Inc. All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or distribute the document in any form. Notice The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide.
Version Record Versi on Author Assessor V1.0.0 Approver Update date 2020-08-18 Remark Initial version Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
Contents 1 2 Foreword ....................................................................................................................... 8 1.1 Introduction................................................................................................................... 8 1.2 Reference Standard ..................................................................................................... 8 1.3 Related Documents ..............................................................................
3.4.1 3.4.1.1 PCIe Interface Definition ............................................................................................................ 45 3.4.1.2 PCIe Interface Application ......................................................................................................... 46 3.4.2 3.5 3.6 3.7 4 PCIe Interface ............................................................................................................... 45 USB Interface .........................................
4.5 GNSS ......................................................................................................................... 65 4.6 Antenna Design Requirement ..................................................................................... 66 5 Thermal Design ...........................................................................................................68 6 Structure Specification ...............................................................................................
1 Foreword 1.1 Introduction The document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of FM150-NA (hereinafter referred to as FM150). With the assistance of the document and other instructions, the developers can quickly understand the hardware functions of FM150 modules and develop products. 1.2 Reference Standard The design of the product complies with the following standards: 3GPP TS 51.010-1 V10.5.
3GPPTS27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment (DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) PCI Express M.2 Specification Rev1.1 1.3 Related Documents FIBOCOM FG150 & FM150 AT Commands User Manual Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
2 Overview 2.1 Introduction FM150 is a highly integrated 5G WWAN module which uses M.2 form factor interface. It supports 5G NR SUB6/LTE FDD/LTE TDD/WCDMA systems and can be applied to most cellular networks of mobile carrier in the world. 2.2 Specification Specification CPU Qualcomm SDX55, 7nm process, ARM Cortex-A7, up to 1.
Specification Support DL 4*4 MIMO Maximum UL peak rate 150Mbps (CAT 13) Maximum DL peak rate 2.0Gbps (CAT 20) Support DL-256QAM, UL-256QAM Support RF bandwidth 5-100MHz NR Sub6 SA Characteristic Support carrier spacing 15KHz and 30KHz optional UL Single TX chain DL Max support 4*4 MIMO Max UL peak rate of 450Mbps Max DL peak rate 2.
Specification Body Sar(Reserved) LED Tunable antenna I2S(Reserved) Software Protocol Stack IPV4/IPV6 AT commands 3GPP TS 27.007 and 27.005 Firmware update USB/PCIe Multiple carrier Other features AGNSS Note: When temperature goes beyond normal operating temperature range, RF performance of module may be slightly off 3GPP specifications. 2.
CA_48A-48A CA_48D CA_4A-46A-46C CA_46E-66A CA_48C CA_48C-48A CA_46A-46C-66A CA_46D-66A-66A CA_2A-46A CA_2A-48A-66A CA_2A-2A-66C CA_2A-7A-7A-66A-66A CA_4A-46A CA_2A-48A-48A CA_46A-48C-66A CA_2A-7C-66A-66A CA_46A-66A CA_2A-48C CA_2A-46A-48C CA_2A-7A-7A-29A-66A CA_2A-29A CA_48A-48A-66A CA_46A-48A-48A-66A CA_2A-7C-29A-66A CA_4A-7A CA_48C-66A CA_2A-46A-48A-48A CA_5A-7C-66A-66A CA_5A-7A CA_4A-46A-46A CA_46A-48D CA_2A-5A-30A-66A-66A CA_5A-66A CA_4A-46C CA_2A-46A-46C CA_5A-29A CA
CA_30A-66A-66A CA_4A-7A-12A CA_5A-66A-66A CA_5A-7A-7A CA_5A-7C CA_5A-7A-66A CA_7A-12A-66A CA_7A-29A-66A CA_7A-7A-29A CA_7C-29A CA_12A-30A-66A CA_2A-12A-30A CA_2A-29A-30A CA_2A-5A-30A CA_29A-30A-66A CA_4A-12A-30A CA_4A-29A-30A CA_4A-5A-30A CA_5A-12A-66A CA_5A-30A-66A CA_2A-12A-12A CA_4A-12A-12A UL CA Combinations 2CA Inter-band Intra-band(contiguous) 2A+12A, 2A+5A, 2A+66A, 2A+4A 4A+12A 5A+66A 66A+12A 5B, 48C 2.
DC_66A_n2A DC_13A_n2A DC_2A-5A_n2A DC_5A-30A_n2A DC_5A-66A_n2A DC_12A-30A_n2A DC_2A-12A_n2A DC_2A-66A_n2A DC_12A-66A_n2A DC_13A-66A_n2A DC_13A-48A_n2A DC_2A-5A-30A_n2A DC_2A-5A-66A_n2A DC_2A-12A-30A_n2A DC_5A-30A-66A_n2A DC_5A-66A-66A_n2A DC_12A-30A-66A_n2A DC_12A-66A-66A_n2A DC_30A-66A-66A_n2A DC_2A-12A-66A_n2A DC_13A-48B_n2A DC_2A-5A-30A66A_n2A DC_2A-12A-30A66A_n2A DC_2A-5A-66A66A_n2A DC_2A-12A-66A66A_n2A DC_5A-30A-66A66A_n2A DC_12A-30A-66A66A_n2A DC_13A-48D_n2A DC_13A-48E_n2A DC_12A_n41A DC_2A_n41A DC_66
DC_2A-2A-66A_n41A DC_2A-46D_n41A DC_2A-46C-66A_n41A DC_46D-66A_n41A DC_2A-46D-66A_n41A DC_2A_n5A DC_66A_n5A DC_48A_n5A DC_2A-5A_n5A DC_2A-66A_n5A DC_2A-2A_n5A DC_2A-12A_n5A DC_2A-30A_n5A DC_5A-66A_n5A DC_12A-66A_n5A DC_30A-66A_n5A DC_66A-66A_n5A DC_2A-48A_n5A DC_2A-46A_n5A DC_46A-48A_n5A DC_46A-66A_n5A DC_7A-66A_n5A DC_48A-66A_n5A DC_2A-2A-30A_n5A DC_2A-2A-66A_n5A DC_2A-5A-66A_n5A DC_2A-30A-66A_n5A DC_2A-66A-66A_n5A DC_30A-66A-66A_n5A DC_66A-66A-66A_n5A DC_2A-46A-48A_n5A DC_2A-46C_n5A DC_46C-48A_n5A DC_46C-
DC_46D-48A_n5A DC_48D-66A_n5A DC_46D-66A_n5A DC_2A-46E_n5A DC_2A-46D-48A_n5A DC_46E-48A_n5A DC_48E-66A_n5A DC_2A-2A-46D_n5A DC_2A-46D-66A_n5A DC_46D-66A-66A_n5A DC_2A-46E-48A_n5A DC_13A_n66A DC_2A_n66A DC_5A_n66A DC_12A_n66A DC_30A_n66A DC_71A_n66A DC_48A_n66A DC_7A_n66A DC_2A-13A_n66A DC_13A-66A_n66A DC_2A-5A_n66A DC_2A-12A_n66A DC_2A-30A_n66A DC_2A-66A_n66A DC_5A-30A_n66A DC_5A-66A_n66A DC_12A-30A_n66A DC_12A-66A_n66A DC_30A-66A_n66A DC_2A-2A_n66A DC_7A-13A_n66A DC_2A-7A_n66A DC_66A-71A_n66A DC_2A-48A_n66
DC_2A-5A-66A_n66A DC_2A-13A-66A_n66A DC_2A-2A-5A_n66A DC_2A-2A-12A_n66A DC_2A-5A-30A_n66A DC_2A-12A-30A_n66A DC_5A-30A-66A_n66A DC_12A-30A-66A_n66A DC_2A-12A-66A_n66A DC_2A-66A-71A_n66A DC_2A-7A-7A_n66A DC_2A-7C_n66A DC_2A-46A-48A_n66A DC_2A-46C_n66A DC_46C-48A_n66A DC_13A-48B_n66A DC_2A-7A-66A_n66A DC_7A-7A-13A_n66A DC_7C-13A_n66A DC_2A-7A-13A_n66A DC_2A-2A-5A30A_n66A DC_2A-2A-5A66A_n66A DC_2A-2A-12A30A_n66A DC_2A-2A-12A66A_n66A DC_2A-5A-30A66A_n66A DC_2A-12A-30A66A_n66A DC_2A-7A-7A13A_n66A DC_2A-7A-7A66A_
DC_2A_n71A DC_66A_n71A DC_2A-7A_n71A DC_66C_n71A DC_2A-66A_n71A DC_2A_(n)71AA DC_66A-66A_n71A DC_66A_(n)71AA DC_2A-46A_n71A DC_46A-66A_n71A DC_2A-2A_n71A DC_66C_(n)71AA DC_2A-66A_(n)71AA DC_2A-46C_n71A DC_2A-46A-66A_n71A DC_2A-66A-66A_n71A DC_46C-66A_n71A DC_2A-2A-66A_n71A DC_2C-66A_n71A DC_2A-66C_(n)71AA DC_2A-46D_n71A DC_2A-46C-66A_n71A DC_46D-66A_n71A DC_2A-46D-66A_n71A DC_7A_n78A DC_5A_n78A DC_66A_n78A DC_2A_n78A DC_12A_n78A DC_4A_n78A DC_7C_n78A DC_5A-7A_n78A DC_7A-7A_n78A DC_66A-66A_n78A DC_2A-7A_n78A
DC_7C-66A_n78A DC_7A-66A-66A_n78A DC_5A-7A-7A_n78A DC_2A-66A-66A_n78A DC_7A-46C_n78A DC_7C-66A-66A_n78A DC_2A-7C-66A_n78A DC_2A-7A-7A66A_n78A DC_2A-7A-66A66A_n78A DC_7A-7A-66A66A_n78A DC_7A-46D_n78A DC_2A-7C-66A66A_n78A DC_2A-7A-7A-66A66A_n78A DC_7A-46E_n78A DC_66A_n7A 7C-66A 7A-66A-66A 7A-7A 2A-66A-66A 7A 7C-66A-66A 2A-7C-66A 2A-7A-7A, 2A-7A-66A, 7A-7A-66A 2A-7A-66A, 2A-66A-66A, 7A-66A-66A 7A-7A-66A, 7A-66A-66A n78A n78A n78A n78A n78A n78A n78A n78A 7A, 66A 7A, 66A 5A, 7A 2A, 66A 7A 7A, 66A 2A, 7A, 66A
The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Fibocom Wireless Inc. that they wish to change the antenna trace design.
user manual shall include all required regulatory information/warning as show in this manual. 2.5.2 FCC Statement Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
your body. 2.5.3 IC Statement Industry Canada Statement This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les utilisateurs, et 2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires.
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
3 Application Interface 3.1 M.2 Interface The FM150 module applies standard M.2 Key-B interface, with a total of 75 pins. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
3.1.1 Pin Map Figure 3-1 Pin Map Note: Pin “Notch” represents the gap of the gold fingers. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
3.1.2 Pin Definition The pin definition is as follows: Pin Pin Name I/O Reset Value Pin Description Type NC, FM150 M.2 module is configured 1 CONFIG_3 O NC as the WWAN – PCIe, USB_SS - interface type. 2 VCC PI - Power input Power Supply 3 GND - - GND Power Supply 4 VCC PI - Power input Power Supply 5 GND - - GND Power Supply Module power on/off input, 6 FULL_CARD_ POWER_OFF# I PU internal 20KΩ pull up CMOS Power on: High/Floating Power off: Low 3.3/1.8V 0.
Pin Pin Name I/O Reset Value Pin Description Type 23 WOWWAN# O PD Wake up host CMOS 1.8V 24 I2S_TX O PD I2S Serial transmit data, Reserved CMOS 1.8V Dynamic power control for SAR 25 DPR I PU interrupt detection, active low. Reserved. CMOS 3.3/1.8V CMOS 26 W_DISABLE2# I PU GNSS disable, active low, Reserved 27 GND - - GND Power Supply 28 I2S_WA O PD I2S Word alignment/select, Reserved CMOS 1.
Pin Pin Name I/O Reset Value Pin Description 45 GND - - 46 UIM2_RESET O L Type GND Power Supply CMOS 3V/1.8V CMOS 3V/1.8V PCIe RX Differential Signals 47 PERn0 I 48 UIM2_PWR PO - SIM2 power supply, 3V/1.8V 49 PERp0 I PCIe RX Differential Signals Positive - - Negative Asserted to reset module PCIe 50 PERST# I PD interface default. Active low, internal pull up(10KΩ). 51 GND - - GND CMOS 3V/1.8V CMOS 3.3V/1.
Pin Pin Name I/O Reset Value Pin Description Type WL_LAA_TX_EN Set HIGH level to 59 LAA_TX_EN O PD blank/isolate 5 GHz WLAN LNAs when CMOS 1.8V n79 transmits power over 10dBm. Receive WLAN_TX_EN (HIGH level) to 60 WLAN_TX_EN I - blank/isolate n79 LNAs when external 5 CMOS 1.8V GHz WLAN TX on. 61 ANTCTL1 O PD Tunable ANT CTRL1, Control signal1 CMOS 1.8V Wireless Coexistence between WWAN and WiFi/BT modules, based on BT-SIG 62 COEX_2 I PD coexistence protocol.
Pin Pin Name I/O Reset Value Pin Description Type 70 VCC PI - Power input Power Supply 71 GND - - GND Power Supply 72 VCC PI - Power input Power Supply 73 NC - - 74 VCC PI - - Power input Power Supply NC, FM150 M.2 module is configured 75 CONFIG_2 O as the WWAN – PCIe, USB_SS NC - interface type. Reset Value: The initial status after module reset, not the status when working.
FM150 module uses PCIe interface, according to the PCIe specification, the PCIe Vmain should be used as the +3.3V power source, not the Vaux. The Vaux is the PCIe backup power source and it is not sufficient as the power supply. In addition, the external DC/DC power supply should not be used, because the external power cannot control the module status through the PCIe protocol. 3.2.1 Power Supply The FM150 module should be powered through the VCC pins, with the continuous current ability of above 2.
Recommended capacitance 18pF, 10pF, 8.2pF, 6.8pF, 3.3pF Application Description 1500/1700/1800/1900, 2100/2300, 2500/2600MHz, Filter out medium/high frequency band RF 3500/3700MHz, 5GHz frequency interference band The stable power supply can ensure the normal operation of FM150 module, and the ripple of the power supply should be less than 300mV in design.
3.2.3 Power Consumption In the condition of 3.8V power supply, the FM150 power consumption as shown in the following table: Parameters Mode Ioff Power off Note 100 uA - 17.5 mA - 17.8 mA 18.5 mA NR FDD TBD mA - NR TDD TBD mA - Power supply, module power off DRX=8 DPC(Default Paging TDD LTE Cycle)=#128 DPC(Default Paging FDD LTE IIDLE Typical Unit WCDMA Condition Cycle)=#128 Current - - Radio Off AT+CFUN=4 Flight Mode 16 mA - WCDMA DRX=8 2.5 mA - 2.5 mA 2.
Parameters Mode Condition WCDMA Data call Band 5 Typical Unit Note 470 mA - 486 mA - 635 mA - 659 mA - 471 mA - 650 mA - 461 mA - 461 mA - 471 mA - 464 mA - 645 mA - 502 mA - 735 mA - 680 mA - 571 mA - Current @+23.5dBm WCDMA Data call Band 8 @+23.
Parameters Mode Condition LTE TDD Data call Band 41 Typical Unit Note 469 mA - 508 mA - 391 mA - 464 mA - mA - mA - mA - mA - mA - mA - mA - mA - mA - Current @+23dBm LTE TDD Data call Band 42 LTE TDD @+23dBm LTE TDD Data call Band 43 @+23dBm LTE TDD Data call Band 48 @+23dBm EN-DC Data call B66+n2 883 @20dBm+20dBm EN-DC Data call B66+n5 848 @20dBm+20dBm EN-DC Data call 66A_n7A 993 @20dBm+20dBm FDD data EN-DC Data call 2A_n12A 799 RMS Current @20dBm+20dBm EN-DC
3.3 Control Signal The FM150 module provides three control signals for power on/off and reset operations, the pin defined as shown in the following table: Pin Pin Name I/O Reset Value Functions Type Module power on/off input, 6 FULL_CARD_POWER I _OFF# PU 67 RESET# I PU 50 PERST# I PD internal 20KΩ pull up Power on: High/Floating Power off: Low WWAN reset input, internal pull up, active low 3.3/1.8V 1.8V Asserted to reset module. CMOS Active low, internal pull up(10KΩ) 3.
3.3.1.2 Start-up Timing Sequence When power supply is ready, the PMU of module will power on and start initialization process by pulling high both FCPO#(Pin6) and RESET#(Pin67) signal, After about 30s, the initialization process of the module will be completed. The start-up timing is shown in Figure 3-5: tpr +3.8V FCPO# ton1 RESET# ton2 PERST# typical 30s Module State OFF Initialization Activation(AT Command Ready) Figure 3-5 Timing Control for Start-up Index Min. Recommended Max.
By sending AT+CPWROFF=0 command, the module will start the finalization process (the reverse process of initialization), and it will be completed after tsd time (tsd is the time which AP receive OK of “AT+CPWROFF=0”, if there is no response, max tsd is 5s). In the finalization process, the module will save the network, SIM card and some other parameters from memory, do the logout, then clear the memory and shut down PMU.
Figure 3-7 Recommended Design for Reset Circuit There are two reset control timings as below: Reset timing 1st in Figure 3-8, PMU of module internal always on in reset sequence, recommend using in FW upgrade and module recovery; Reset timing 2nd in Figure 3-9, PMU of module internal will be off in reset sequence (including whole power off and power on sequence, tsd can refer section 3.3.2), recommend using in system warm boot. +3.
+3.8V toff FCPO# toff2 RESET# ton1 toff1 AT+CFUN=0 ton2 PERST# typical 30s tsd Module State Activation Finalization OFF Initialization Activation Figure 3-9 Reset timing2nd Index Min. Recommended Max. toff1 16ms 20ms - toff2 0 - - Comments RESET# should be asserted after PERST#, refer section 3.3.2 FCPO# should be asserted after RESET#, refer section 3.3.
3.3.4 PCIe Link State 3.3.4.1 D0 L1.2 Module supports PCIe goes into D0 L1.2 state in Win10 system. The D0D0 L1.2@S0/S0ixD0 timing is shown in figure 3-10: +3.8V FCPO# RESET# PERST# Module State D0 D0 L1.2@S0/S0ix D0 Figure 3-10 D0 L1.2 timing Note: When USB is used as data transfer interface in Android/Linux OS, there is no PCIe link state. But when USB goes into suspend it also needs to follow the timing above (If PERST# is floating, don’t control PERST#). 3.3.4.
+3.8V FCPO# RESET# PERST# Module State D3cold L2@S0/S0ix D0 D0 Figure 3-11 D3cold L2 timing Note: When USB is used as data transfer interface in Android/Linux OS, there is no PCIe link state, so don’t need to follow timing above. 3.3.5 Timing Application The recommended timing application in Win10 OS is as below table: System status Timing Application D0 L1.2 S0ix (Modem standby) D3cold L2 Refer to section 3.3.4.1 Figure 3-10 D0 L1.2 Timing S3,S4,S5 G3 boot Refer to section 3.3.4.
System status Timing Application Connect standby Refer to section 3.3.4.1 Figure 3-10 D0 L1.2 timing Restart Refer to section 3.3.3 Figure 3-9 Reset timing 2nd Modem FW upgrade / Modem recovery Refer to section 3.3.3 Figure 3-8 Reset timing 1st 3.4 PCIe & USB 3.4.1 PCIe Interface FM150 module supports PCIe Gen3, one lane for data transmission channel. It is also compatible with PCIe Gen1/Gen2.
Pin# Pin Name I/O Reset Value Description Type also used by L1 PM Sub states mechanism, asserted by either host or device to initiate an L1 exit. Active low, internal pull up (10KΩ). Wake up system and reactivate PCIe link from L2 to L0, it depends on system whether 54 PEWAKE# O L 1.8V/3.3V supports wake up functionality. Active low, open drain output and should add external pull up on platform. 3.4.1.
It shall avoid the discontinuous reference ground, such as segment and space; When the differential signal lines go through different layers, the via hole of grounding signal should be close to that of signal, and generally, each pair of signals require 1-3 grounding signal via holes and the lines shall never cross the segment of plane; Try to avoid bended lines and avoid introducing common-mode noise in the system, which will influence the signal integrity and EMI of difference pair.
Figure 3-14 Length Match Design of PCIe Difference Pair 3.4.2 USB Interface The FM150 module supports USB2.0 which is compatible with USB High-Speed (480 Mbit/s) and USB Full-Speed (12 Mbit/s).It supports USB3.1 Gen2 using for 5G high speed data throughput at the same time. For the USB timing and electrical specification of FM150 module, please refer to Universal Serial Bus Specification 2.0” and “Universal Serial Bus Specification 3.1”.
Since the module supports USB 2.0 High-Speed, it is required to use TVS diodes with equivalent capacitance of 1pF or smaller ones on the USB_D-/D+ differential signal lines, it is recommended to use 0.5pF TVS diodes. USB_D- and USB_D+ are high speed differential signal lines with the maximum transfer rate of480 Mbit/s, so the following rules shall be followed carefully in the case of PCB layout: USB_D- and USB_D+ signal lines should have the differential impedance of 90±10 ohms.
3.5 USIM Interface The FM150 module supports dual SIM card single standby, has dual built-in USIM card interface, which supports 1.8V and 3V SIM cards. 3.5.1 USIM1 Pins The USIM1 pins description as shown in the following table: Pin Pin Name I/O Reset Value Description Type 36 UIM1_PWR PO - USIM1 power supply 1.8V/3V 30 UIM1_RESET O L USIM1 reset 1.8V/3V 32 UIM1_CLK O L USIM1 clock 1.8V/3V 34 UIM1_DATA I/O L USIM1 data, internal pull up(20KΩ) 1.
3.5.3 USIM Interface Circuit 3.5.3.1 N.C. SIM Card Slot The reference circuit design for N.C. (Normally Closed) SIM card slot is shown in Figure 3-17: Figure 3-17 Reference Circuit for N.C. SIM Card Slot The principles of the N.C.SIM card slot are described as follows: When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives the SIM_DETECT pin low.
SIM_DETECT pin low. When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives the SIM_DETECT pin high. 3.5.4 USIM Hot-Plugging The FM150 module supports the SIM card hot-plugging function, which determines whether the SIM card is inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot.
The SIM card slot with a metal shielding housing can improve the anti-interference ability. The trace length between the SIM card slot and the module should not exceed 100mm, or it could reduce the signal quality. The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalk interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with GND as a group at least.
Figure 3-19 LED Driving Circuit Note: Module internal rated current sink <10mA.The resistance of LED current-limiting resistor is selected according to the driving voltage and the driving current. 3.6.2 WOWWAN# The WOWWAN# signal is used to wake the Host (AP) when there comes the data request. The definition of WOWWAN# signal is as follows: Operating Mode WOWWAN# Signal SMS or data requests Pull low 1s then pull high (pulse signal).
W_DISABLE1# signal Function High/Floating WWAN function is enabled, the module exits the Flight mode. Low WWAN function is disabled, the module enters Flight mode. The function of GNSS can be enabled or disabled by hardware pin. W_DISABLE2# signal High/Floating during power on Pull Low during power on Function Enable GNSS Disable GNSS Note: The function of W_DISABLE1# can be customized, please refer to the software porting guide. 3.7.
Pin Pin Name I/O 61 ANTCTL1 O Pin Description Type Tunable ANT control, GPO interface, control CMOS 1.8V signal1 63 ANTCTL2 O Tunable ANT control, GPO interface, control CMOS 1.8V signal2 65 ANTCTL3 O Tunable ANT control, GPO interface, control CMOS 1.8V signal3 3.9 Configuration Interface The FM150 module provides four configuration pins for the configuration as the WWAN-PCIe, USB3.1 type M.
Figure 4-1 RF connectors 4.1.2 RF Connector Characteristic Rated Condition Environment Condition Frequency Range DC to 6GHz Temperature Range Characteristic Impedance 50Ω –40°C to +85°C 4.1.3 RF Connector Dimension FM150 module adopts standard M.2 module RF connectors, the model name is 818004607 from ECT company, and the connector size is 2*2*0.6m. The connector dimension is shown as following picture: Reproduction forbidden without Fibocom Wireless Inc.
Figure 4-2 RF connector dimensions Figure 4-3 0.81mm coaxial antenna dimensions Figure 4-4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector Note: RF connector is a kind of precision connector. Please use special tools to assemble RF cable to avoid damage. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
4.1.4 RF Connector Assembly Mate RF connector parallel refer Figure 4-5, do not slant mate with strong force. Figure 4-5 Mate RF connector To avoid damage to the RF connector during extraction, it is recommended to use pulling JIG as Figure 4-6, and the pulling JIG must be lifted up vertically to PCB surface (see Figure 4-7 and 4-8). Figure 4-6 Pulling JIG Figure 4-7 Lift up pulling JIG Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
Figure 4-8 Pulling direction 4.
Operating Band Description Mode Tx (MHz) Rx (MHz) Band 30 2300MHz LTE FDD 2305-2315 2350-2360 Band 41 2500MHZ LTE TDD 2496-2690 2496-2690 Band 42 3500MHZ LTE TDD 3400-3600 3400-3600 Band 43 3700MHZ LTE TDD 3600-3800 3600-3800 Band 46 5200MHZ LTE TDD N/A 5150-5925 Band 48 3600MHZ LTE TDD 3550-3700 3550-3700 Band 66 1700MHz LTE FDD 1710-1780 2110-2200 Band 71 600MHz LTE FDD 663-698 617-652 n2 1900MHz NR 1850-1910 1930-1990 n5 850MHz NR 824-849 869-894 n7
Mode WCDMA LTE 3GPP Requirement(dBm) Band 1 24+1.7/-3.7 23.5±1.5 Band 2 24+1.7/-3.7 23.5±1.5 dBm Band 4 24+1.7/-3.7 23.5±1.5 dBm Band 5 24+1.7/-3.7 23.5±1.5 dBm Band 8 24+1.7/-3.7 23.5±1.5 dBm Band 2 23±2.7 23±1.5 dBm Band 4 23±2.7 23±1.5 dBm Band 5 23±2.7 23±1.5 dBm Band 7 23±2.7 23±1.5 dBm Band 12 23±2.7 23±1.5 dBm Band 13 23±2.7 23±1.5 dBm Band 14 23±2.7 23±1.5 dBm Band 17 23±2.7 23±1.5 dBm Band 25 23±2.7 23±1.5 dBm Band 26 23±2.7 23±1.
Mode Tx Power Typical (dBm) Unit n48 HPUE mode:26+2+TT/3-TT 23+2+TT/-3-TT 21±1 dBm n66 23+2+TT/-3-TT 23±1.5 dBm 23+2+TT/-3-TT 23±1.5 dBm 23+2+TT/-3-TT 21±1 dBm Band n71 n78 3GPP Requirement(dBm) Note: TT :Test Tolerance f ≤ 3.0GHz 3.0GHz < f ≤ 4.2GHz 4.2GHz < f ≤ 6GHz BW ≤ 40MHz 0.7dB 1.0dB 1.0dB 40mHz < BW≤ 100MHz 1.0dB 1.0dB 1.0dB 4.4 Receiver Sensitivity 4.4.
Mode 3GPP Requirement (dBm) Band 14 -93.3 Band 17 -93.3 -103.9 dBm Band 25 -92.8 -101.1 dBm Band 26 -93.8 -103.5 dBm Band 29 -93.3 -101 dBm Band 30 -95.3 -99.5 dBm Band 66 -95.8 -101.5 dBm Band 41 -94.3 -100.4 dBm Band 42 -95 -103.4 dBm Band 43 -95 -103 dBm Band 48 -95 -103.0 dBm Band 46 -88.5 -97.3 dBm Band 71 -93.3 -104.1 dBm n2 -91.1 -99.2 dBm -90.1 -103.5 dBm -91.3 -97.5 dBm -93.1*(BW=10M) -104.8 dBm -89.6 -98.4 dBm n41 -84 -88.
4.4.2 Four Antenna Receiver Sensitivity Some middle/high bands support four antenna, the receiver sensitivity for some middle/high bands of FM150 module is shown in below table: Mode Band LTE (10M) NR FDD(20M) TDD(100M) 3GPP Requirement (dBm) Rx Sensitivity(dBm) Typical Unit Band 2 -97.0 -104.2 dBm Band 4 -99 -103.9 dBm Band 7 -97.0 -104.0 dBm Band 25 -95.5 -104.0 dBm Band 30 -93.5 -103.4 dBm Band 66 -98.5 -104.3 dBm Band 41 -97.0 -104.1 dBm Band 42 -97.2 -104.
Parameter Description C/No TTFF CEP Result Unit Note Tracking -159 dBm - -130dBm 40 dB-Hz - Cold Start 40 s - Warm Start 35 s - Hot Start 2 s - Static accuracy 2 m - Note: The data above is an average value tested on some samples at 25°C temperature. 4.
FM150 module Main antenna requirements LTE band 30(2300): 55 MHz LTE band 41(2500): 194 MHz LTE band 42(3500): 200 MHz LTE band 43(3700): 200 MHz LTE band 46(5200): 775 MHz LTE band 66(1700): 490 MHz LTE band 71(600): 81 MHz n2(1900): 140 MHz n5(850): 70 MHz n7(2600): 190 MHz n12(700): 47 MHz n25(1900): 145 MHz NR n41(2500): 194 MHz n48(3600)：150 MHz n66(1700): 490 MHz n71(600): 81 MHz n78(3500): 500 MHz GPS: 2 MHz GLONASS: 8MHz Bandwidth(GNSS) BDS: 4MHz Galileo: 33MHz QZSS: 2MHz Impedance 50 ohm Inp
carrier TRP certification fail. About antenna Design, please refer to the document FIBOCOM Design Guide_RF Antenna 5 Thermal Design FM150 is designed to work on an extreme temperature range, to make sure the module can work properly for a long time and achieve a better performance on conditions like maximum power or high data transmission. Heat conducting material is strongly recommended to add between the bottom of module and the customer main board.
Figure 6-2 Dimension of Structure 6.3 M.2 Interface Model The FM150 M.2 module adopts 75-pin gold finger as external interface, where 67 pins are signal pins and 8 pins are notch pins as shown in Figure 3-1. For module dimension, please refer to 6.2 Dimension of Structure. Based on the M.2 interface definition, FM150 module adopts Type 3052-S3-B interface (30x52mm, the component maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B). 6.4 M.
Figure 6-3 M.2 Dimension of Structure 6.5 Storage 6.5.1 Storage Life Storage Conditions (recommended): Temperature is 23 ± 5 ℃, relative humidity is less than RH 60%. Storage period: Under the recommended storage conditions, the storage life is 12 months. 6.6 Packing The FM150 module uses the tray sealed packing, combined with the outer packing method using the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to the greatest extent.
Figure 6-4 Tray Packaging Process Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
6.6.2 Tray size The pallet size is 330*175*6.5mm, as shown in Figure 6-5: Figure 6-5 Tray Size (Unit: mm) Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
