L860GL Datasheet v1.0

ManualsBrandsFibocom ManualsElectronicsL860 LTE Cat16 Cellular Module

L860-GL LTE Module

Perfect Wireless Experience

L860-GL LT E M odule Technical Specifications

Product Features

Chipset: Intel XMM7560 eSIM interface support

LTE FDD：LTE FDD: Band 1, 2, 3, 4, 5, 7, 8, 12, 13, 14,

17, 18, 19, 20, 21, 25, 26, 28, 29, 30, 32, 66

LTE TDD: B38/39/40/41/42

UMTS: Band 1, 2, 4, 5, 8

Operating Voltage: 3.135V~4.4V, Typical 3.3V

Operating Temperature: -10~+55°C

Storage Temperature: -40~+

85°C

AT Command Set: 3GPP TS 27.007 and 27.005, proprietary

FIBOCOM AT commands

M.2: 30.0*42.0*2.3 mm

DL 5CA on 4 bands, DL 256QAM support

DL-MIMO: 2*2, 4*2, 4*4

DL 4x4 MIMO: Band 1,2,3,4,7,30,40,41NB, 66

LAA(Band 46)

Integrated GNSS

TX Power:

FDD& TDD LTE: 23dBm

WCDMA: 23.5dBm

RX Sensitivity:

FDD& TDD LTE: -98dBm~102dBm

Data

FDD& TDD LTE: 1Gbps DL(Cat 16), 150Mbps

UL(Cat 13, 2CA on intra bands)

UMTS/HSPA+: 42Mbps DL

(Cat 24), 11.5Mbps

UL(Cat 7)

Interface

USIM: 3V/1.8V

PCIe

BodySar

Driver Approval

Linux

indows 10

CE / CCC / FCC / GCF / PTCRB etc. 100+ countries

certification

AT& T / Verizon /Sprint / DT / Telefonica / Vodafone /

Swisscom / Docomo / KDDI / Softbank / Telstra /Optus

Note*: Planning

F i b o c o m . c o m

P E R F E C T W I R E L E S S E X P E R I E N C E

Summary of content (1 pages)

PAGE 1
L860-GL LTE M odule Perfect W ireless Experience L860-GL LT E M odule Technical Specifications Product Features Chipset: Intel XMM7560 LTE FDD：LTE FDD: Band 1, 2, 3, 4, 5, 7, 8, 12, 13, 14, 17, 18, 19, 20, 21, 25, 26, 28, 29, 30, 32, 66 LTE TDD: B38/39/40/41/42 UMTS: Band 1, 2, 4, 5, 8 M.2: 30.0*42.0*2.3 mm DL 5CA on 4 bands, DL 256QAM support DL-MIMO: 2*2, 4*2, 4*4 DL 4x4 MIMO: Band 1,2,3,4,7,30,40,41NB, 66 LAA(Band 46) Integrated GNSS eSIM interface support Operating Voltage: 3.135V~4.4V, Typical 3.