Datasheet

GmbH & Co. KG, Nottebohmstr.28, D-58511 Lüdenscheid, Tel.: [phone]
www.fischerelektronik.de e-mail: [e-mail]
Issur: 06 / 2013 1 Copyright 
Fischer Elektronik 2013
Thermally Conductive Adhesive WLK DK
WLK DK is an aluminium oxide-filled, temperature-resistant, impact-resistant, solvent-free
and thermally conductive two-component adhesive epoxy compound with a short pot life.
The thermally conductive adhesive glues both porous and non-porous surfaces of metals,
glass, ceramics and almost all plastics. Hardening is possible at room temperature.
Application: Thermally conductive gluing
Hardening: Approx. 16 hours at room temperature, 4 hours at 60°C
(These specifications are only guidance values. The actual hardening times
under various ambient conditions have to be determined in specific tests).
Further processing: After approx. 4-6 hours (depending on the layer thickness)
Temperature range: -50°C to +145°C
Technical data before hardening:
Mixture ratio
Colour Part A
Colour Part B
Colour mix
Density Part A
Density Part B
Density mix
Viscosity Part A
Viscosity Part B
Viscosity mix
Pot life at room temp.
A : B = 1 : 1
red
blue
violet
2.13
1.91
1.96
80-130
50-100
100-300
approx. 30
parts by volume
g/cm³
g/cm³
g/cm³
Pas
Pas
Pas
Min.
Technical data after hardening (4h at 60°C):
Density (21°C)
Glass transition temp.
Linear thermal
expansion coefficient (<Tg)
Linear thermal
expansion coefficient (>Tg)
Specific electrical
resistivity
Electrical
dielectric strength
Shore D hardness
Temperature resistance
Thermal conductivity
1.99
approx. 25
28
126
8x10
11
>15
50
1
g/cm³
°C
ppm/K
ppm/K
Ohmxcm (1000V)
kV/mm (DC)
scale divisions
s.a.
W/mK