Datasheet

Fischer Elektronik GmbH & Co. KG • Postfach 1590 • Nottebohmstr. 28 • D-58511 Lüdenscheid • Tel. [phone]
www.fischerelektronik.de [e-mail]
Thermally Conductive Adhesive WLK
Epoxy based 2 component adhesive.
The main characteristics are its good heat conductivity, high dielectric strength, and an
expansion coefficient suited to copper and aluminium. The thermally conductive adhesive binds
porous and non-porous surfaces such as metal, glass, ceramic and almost all plastics.
Technical data :
Expansion coefficient 8,5×10
-6
/°C
Volume resistivity 10
16
Ohm/cm
Dielectric strength 400 V/10
-3
inch
Water absorption (in 7 days) < 0,1 %
Spec. Gravity Resin 2,3 g/cm3
Spec. Gravity Hardener 1,003
Spec. Gravity Compound cured 2,1
Hardness 75 SHORE D at 25 °C
Viscosity Resin 0,9 Mio …. 1,3 Mio cps
Viscosity Hardener 1 …. 3 cps
Viscosity Compound 250.000 …. 300.000 cps (25°C)
Thermal conductivity 0,836 W/m K
Temperature range -56 °C ... +150 °C
Below mentioned data are characteristical data for fully cured epoxy
Bond Shear strength ( 1 inch overlapping )
at ca. 25 °C 2,9 psi
at ca. 51 °C 2,2 psi
at ca. 93 °C 1,4 psi
After 30 days stored under water unchanged
Bending strength approx. 15 psi
Expansion coefficient 15x10
–6
per °F
- 2 -