Datasheet

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created on: 2005 revised date: 07/2019 version: 2.0
Technical Data on silicone-free thermal transfer compound WLPF
Application
WLPF thermal conductive paste ensures a safe operation as well as rapid and safe thermal conduction
by making a thermal connection between a semiconductor and a heatsink.
The silicone-free thermal conductive paste should always be used if there is a danger of contamination
of contact systems by silicone or the application is located in a silicon sensitive area.
Purpose:
Using the thermal conductive paste the heat transfer between semiconductor components and heatsinks
can be significantly reduced. WLPF is electrically non-conductive but it is no insulator, and it adapts itself
perfectly to any unevenness in the surfaces being processed.
Special features:
It is resistant to oxidation and ageing, suitable for use over a large temperature range,
nontoxic, has virtually no smell, low oil separation, very low thermal resistivity and
it is chemically neutral to a large extent with respect to metallic and plastic materials.
The dielectric properties change slightly depending on the operating temperature. WLPF does not run
out from the joint under a thermal load and it does not dry or harden.
Examples for applications:
By applying WLPF thermal conductive paste, an optimum adaptation to any roughness in the surfaces of
semiconductors and heatsinks is ensured.
Air inclusions with poor conduction of heat are positively prevented WLPF is successfully used for all
kinds of components including transistors, diodes, thyristors and other integrated devices.
Classification as a hazardous material:
Please see material safety data sheet