Users Manual

Flairco
m
The sol
d
each ap
p
Pre-hea
t
2 ℃ /s.
T
150 ℃ .
and co
m
Equilib
r
solder p
a
with ele
v
and sta
r
PCB bo
a
for this
z
Equilib
r
recomm
e
m
m Microele
c
d
ering pr
o
p
lication.
T
t
zone (A)
T
he purpos
This sta
g
m
pletely re
m
r
ium Zone
a
rticles an
d
v
ation of t
e
r
t eliminat
a
rd. The t
e
z
one.
r
ium Zone
e
nded to
k
c
tronics, Inc
.
o
file depe
n
T
he data h
e
F
— This z
o
e of this z
o
g
e is req
u
m
ove solv
e
1 (B) —
I
d
spread
o
e
mperatur
e
ing oxide
e
mperatur
e
2 (c) (opti
k
eep the t
e
.
Recom
m
n
ds on v
a
e
re is give
F
i
g
ure 14: R
e
o
ne raises
o
ne is to p
u
ired to
d
e
nt to redu
I
n this sta
g
o
ver PCB
b
e
and lique
film form
e
is recom
m
onal) — I
n
e
mperatur
e
m
ended Re
a
rious par
a
n only for
g
e
commend
e
the temp
e
reheat the
d
istribute t
h
ce the he
a
g
e the flux
b
oard, pre
v
faction of
f
ed on th
e
m
ended to
n
order to
e
in 210 –
2
flow Profi
l
a
meters n
g
uidance
o
e
d Reflow
P
e
rature at
a
PCB boa
r
h
e heat
u
a
t shock to
becomes
s
v
enting th
e
f
lux, each
a
e
surface
be 150
℃
t
resolve th
e
2
17 ℃ for
a
FL
C
l
e
ecessitati
n
o
n solder r
P
rofile
a
controlle
d
r
d and co
m
u
niformly
t
compone
n
s
oft and u
n
e
m from b
e
a
ctivator
a
of each
s
t
o 210 ℃ f
o
e
upright
c
a
bout 20 t
o
C
-BTM020
n
g a set
eflow.
d
rate, ty
p
m
ponents
t
o the PC
n
ts.
n
iformly e
n
e
ing re -ox
i
a
nd rosin g
s
older pa
r
o
r 60 to 12
c
omponent
o
30 secon
Datashe
e
-33-
up for
p
ically 0.5
to 120 ~
B board
n
capsulate
i
dized. Als
o
et activat
e
r
ticle and
0 second
issue, it i
s
d.
e
t
–
s
o
e
d
s