User's Manual

Flairmesh Technologies Confidential -20-
8 Reflow Profile
FMB100 is compatible with industrial standard reflow profile for Pb-free solders. The soldering profile
depends on various parameters
necessitating a set up for each application. The data here is given only for
guidance on solder re-flow.
There are four zones:
Preheat Zone - This zone raises the temperature at a controlled rate, typically 1-2.5°C/s.
Equilibrium Zone - This zone brings the board to a uniform temperature and also activates the flux. The
duration in this zone (typically 2-3 minutes) will need to be adjusted to optimise the out gassing of the flux.
Reflow Zone- The peak temperature should be high enough to achieve good wetting but not so high as to
cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth
which can result in a brittle joint.
Cooling Zone - The cooling rate should be fast, to keep the solder grains small which will give a longer
lasting joint. Typical rates will be 2-5°C/s.
Figure 6: Typical Lead-Free Re-flow Solder Profile for FMB100
Key features of the profile:
■ Initial Ramp = 1-2.
5°C/sec to 175°C ±25°C equilibrium
■ Equilibrium time = 60 to 180 seconds
■ Ramp to Maximum temper
ature (250°C) = 3°C/sec max.
■ Time above
liquidus temperature (217°C): 45-90 seconds
■ Device absolute maximum reflow temperat
ure: 255°C
Note: Customer might choose a local 0.2mm thickness solder cream for the module, or use 0.15mm to
match other components in the same PCB.
9 Package
TBD