User Manual
Table Of Contents
- 1 Legal disclaimer
- 2 Warnings & Cautions
- 3 Notice to user
- 4 Customer help
- 5 Quick Start Guide
- 6 Parts lists
- 7 A note about ergonomics
- 8 Camera parts
- 9 Screen elements
- 10 Navigating the menu system
- 11 External devices and storage media
- 12 Pairing Bluetooth devices
- 13 Configuring Wi-Fi
- 14 Fetching data from external Extech meters
- 15 Handling the camera
- 15.1 Charging the battery
- 15.2 Inserting the battery
- 15.3 Removing the battery
- 15.4 Turning on and turning off the camera
- 15.5 Adjusting the angle of lens
- 15.6 Mounting an additional lens
- 15.7 Removing an additional infrared lens
- 15.8 Attaching the sunshield
- 15.9 Using the laser pointer
- 15.10 Calibrating the compass
- 15.11 Calibrating the touchscreen LCD
- 16 Working with images and folders
- 17 Working with fusion
- 18 Working with video
- 19 Working with measurement tools and isotherms
- 20 Annotating images
- 21 Programming the camera
- 22 Changing settings
- 23 Cleaning the camera
- 24 Technical data
- 25 Pin configurations
- 26 Dimensions
- 27 Application examples
- 28 About Flir Systems
- 29 Glossary
- 30 Thermographic measurement techniques
- 31 History of infrared technology
- 32 Theory of thermography
- 33 The measurement formula
- 34 Emissivity tables
Emissivity tables34
Table 34.1 T: Total spectrum; SW: 2–5 µm; LW: 8–14 µm, LLW: 6.5–20 µm; 1: Material; 2: Specification;
3:Temperature in °C; 4: Spectrum; 5: Emissivity: 6:Reference (continued)
1 2 3 4 6 6
Chromium polished 500–1000 T 0.28–0.38 1
Clay fired
70 T 0.91 1
Cloth
black 20 T 0.98 1
Concrete
20 T 0.92 2
Concrete
dry 36
SW
0.95 7
Concrete
rough 17
SW
0.97 5
Concrete walkway 5 LLW 0.974 8
Copper
commercial,
burnished
20 T 0.07 1
Copper
electrolytic, care-
fully polished
80 T 0.018 1
Copper
electrolytic,
polished
–34 T 0.006 4
Copper
molten 1100–1300 T 0.13–0.15 1
Copper
oxidized 50 T 0.6–0.7 1
Copper
oxidized to
blackness
T 0.88 1
Copper oxidized, black 27 T 0.78 4
Copper
oxidized, heavily 20 T 0.78 2
Copper polished 50–100 T 0.02 1
Copper
polished 100 T 0.03 2
Copper polished,
commercial
27 T 0.03 4
Copper
polished,
mechanical
22 T 0.015 4
Copper pure, carefully
prepared surface
22 T 0.008 4
Copper
scraped 27 T 0.07 4
Copper dioxide
powder T 0.84 1
Copper oxide
red, powder T 0.70 1
Ebonite T 0.89 1
Emery coarse 80 T 0.85 1
Enamel 20 T 0.9 1
Enamel lacquer 20 T 0.85–0.95 1
Fiber board hard, untreated 20
SW
0.85 6
Fiber board masonite 70
SW
0.75 9
Fiber board masonite 70 LW 0.88 9
Fiber board particle board 70
SW
0.77 9
Fiber board particle board 70 LW 0.89 9
Fiber board porous, untreated 20
SW
0.85 6
Gold
polished 130 T 0.018 1
Gold polished, carefully 200–600 T 0.02–0.03 1
Gold polished, highly 100 T 0.02 2
Granite
polished 20 LLW 0.849 8
Granite
rough 21 LLW 0.879 8
#T559772; r.5948/5948; en-US
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