Data Sheet

AP6255
Datasheet
15
6.2
Recommended Footprint
 Solder paste layer design is generally the same as recommended footprint.
(錫膏層設計通常建議和焊墊尺寸相同)
 If soldering quality with good wetting on upright side is essential for PQC, how to optimize the
aperture design in the stencil to adjust the amount of solder paste would be crucial.
In addition, a kind of stencil design with stepped thickness in partial area would be considered
if the thickness of stencil is about 0.1mm or thinner.
(如果模組吃錫品質考量側面爬錫，如何優化鋼網開孔設計以調整適當的錫膏量是非常重
要的。尤其鋼網的厚度大約是 0.1mm 或更薄時，可考慮局部加厚鋼網的設計。).