Data Sheet

AP6255
Datasheet
34
9. Recommended Reflow Profile
Temperature
<260°C
217°C
200°C
150°C
3°C /sec max.
60~90s
typically
3°C /sec max.
3°C /sec max.
60~120s
typically
Ramp up Soak
Reflow
Cool down
Time
1. Referred to IPC/JEDEC standard
2. Peak Temperature : <260°C
3. Cycle of Reflow : 2 times max.
4. Adding Nitrogen (N2) to implement 2000ppm or less of oxygen concentration during reflow
process is recommended.
5. If the shelf time is exceeded, be sure baking step to remove the moisture from the
component.