Specifications

6223C-PUD
FN-LINK TECHNOLOGY LIMITED Proprietary & Confidential Information
2
CONTENTS
1 Overview....................................................................................................................................1
1.1 Introduction......................................................................................................................... 1
1.2 Features.............................................................................................................................. 1
1.4 General Specification........................................................................................................ 2
1.5 Recommended Operating Rating....................................................................................3
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1.6 EEPROM Information....................................................................................................3
2 Wi-Fi RF Specification....................................................................................................... 4
2.1 2.4GHz RF Specification.................................................................................................. 4
2.2 5GHz RF Specification......................................................................................................5
3 Bluetooth Specification.....................................................................................................7
3.1 Bluetooth Specification..................................................................................................... 7
4 Pin Assignments................................................................................................................. 8
4.1 Pin Outline............................................................................................................................8
4.2 Pin Definition........................................................................................................................9
5 Dimensions...........................................................................................................................12
5.1 Module Picture................................................................................................................... 12
5.2 Physical Outline.............................................................................................................12
5.3 Module Physical Dimensions...................................................................................13
5.4 Connector Specification..........................................................................................13
5.5 Marking Description................................................................................................ 14
6 Host Interface Timing Diagram....................................................................................... 15
6.1 PCIe Bus during Power On Sequence..........................................................................15
6.2 PCIe PERST# Timing Sequence................................................................................... 15
6.3 Power Off Sequence........................................................................................................ 16
7 Reference Design................................................................................................................ 17
8 Ordering Information......................................................................................................... 18
9 The Key Material List.......................................................................................................... 18
10 Recommended Reflow Profile.......................................................................................19
11 Package Information.........................................................................................................20
11.1 Reel....................................................................................................................................20
11.2 Carrier Tape Detail...........................................................................................................20
11.3 Packaging Detail...............................................................................................................21
12. Moisture sensitivity............................................................................................................ 21