PRODUCT SPECIFICATION 6252B-SR Wi-Fi Dual-band 2x2 11ax + Bluetooth 5.2 Combo Module Version:v1.
6252B-SR Module Datasheet Ordering Information Part NO. FG6252BSRX-01 Description RTL8852BS ,a/b/g/n/ac/ax,Wi-Fi+BT5.2,2T2R,SDIO+UAR T, 3 Antenna ,no shielding Customer: Customer P/N: Signature: Date: Office: 14th floor, Block B, phoenix zhigu, Xixiang Street, Baoan District, Shenzhen Factory: NO.8, Litong RD., Liuyang Economic & Technical Development Zone, Changsha, CHINA TEL:+86-755-2955-8186 FN-LINK TECHNOLOGY LIMITED Website:www.fn-link.
6252B-SR CONTENTS 1. General Description.............................................................................................................. 5 1.1 Introduction......................................................................................................................... 5 1.2 Description.......................................................................................................................... 5 2. Features..................................................................
6252B-SR Revision History Version Date Contents of Revision Change Preparde Checked Approved V1.0 2021/08/27 Initial Release FC Lgp Szs V1.1 2021/7/30 Modify DBDC to DBSC FC LXY QJP V1.
6252B-SR 1. General Description 1.1 Introduction Fn-Link Technology would like to announce a low-cost and low-power consumption module which has all of the Wi-Fi functionalities.It is a highly-integrated IEEE 802.11 a/b/g/n/ac/ax MAC/Baseband/RF WLAN single chip.For Wireless LAN operation. The integrated module provides SDIO interface for Wi-Fi.The module provides simple legacy and 20MHz/40MHz/80MHz co-existence mechanism to ensure backward and network compatibility.
252B-SR 2. Features General Highly integrated wireless local area network (WLAN) system-on-chip (SOC) for 802.11a/b/g/n/ac/ax WLAN applications Supports Dual band Single concurrent (2.4G/5G). PHY Features Dual-stream spatial multiplexing up to 1201 Mbps data rate. Supports 20/40MHz at 2.4GHz and supports 20/40/80MHz at 5GHz Supports Transmit Beamforming Host Interface Supports low power SDIO3.0(complies with SDIO 1.1/2.0) interface for WLAN and UART/PCM interface for Bluetooth.
6252B-SR 3.
6252B-SR 4. General Specification 4.1 WI-FI 2.4GHz Specification Feature Description WLAN Standard IEEE 802.11 b/g/n/ac/ax Wi-Fi compliant Frequency Range 2.412 GHz ~ 2.462 GHz (2.4 GHz ISM Band) Number of Channels 2.4GHz：Ch1 ~ Ch11 Test Items Typical Value EVM 802.11b /11Mbps : 22dBm ± 2 dB EVM -10dB 802.11g /54Mbps : 20dBm ± 2 dB EVM -25dB 802.11n /MCS7 EVM -28dB Output Power1 : 22dBm ± 2 dB 802.11ac vHT20 MCS8: 20dBm ± 2 dB EVM -30dB 802.
6252B-SR 4.2 WI-FI 5GHz Specification Feature Description WLAN Standard IEEE 802.11a/n/ac/ax, Wi-Fi compliant Frequency Range 5.15 GHz ~ 5.850 GHz(5.0 GHz ISM Band) Test Items Typical Value Output Power1 EVM 802.11a /54Mbps: 14 dBm ± 2 dB EVM -25dB 802.11n /MCS7: 13 dBm ± 2 dB EVM -28dB 802.11ac vHT20 MCS8: 12 dBm ± 2 dB EVM -30dB 802.11ac vHT40 MCS9: 13 dBm ± 2 dB EVM -32dB 802.11ac vHT80 MCS9: 12 dBm ± 2 dB EVM -32dB 802.11ax HE20 MCS11: 10 dBm ± 2 dB EVM -35dB 802.
6252B-SR 5GHz(20MHz) Channel table 1 Band range 5180MHz~5240MHz 5260MHz~5320MHz 5550MHz~5700MHz 5745MHz~5825MHz Operating Channel Numbers Channel center frequencies(MHz) 36 5180 40 5200 44 5220 48 5240 52 5260 56 5280 60 5300 64 5320 100 5500 104 5520 108 5540 112 5560 116 5580 132 5660 136 5680 140 5700 149 5745 153 5765 157 5785 161 5805 165 5825 Note: The Wi-Fi RF specification data will be updated in future version.
6252B-SR 4.3 Bluetooth Specification Feature Description General Specification Bluetooth Standard Bluetooth V5.2. Host Interface UART Antenna Reference Small antennas with 0~2.98dBi peak gain Frequency Band 2402 MHz ~ 2480 MHz Number of Channels 79 channels Modulation GFSK, π/4-DQPSK, 8-DPSK RF Specification Output Power (Class 1) Min(dBm) Typical(dBm) -0.468 1.202 Sensitivity @ BER=0.1% -92 for GFSK (1Mbps) Sensitivity @ BER=0.01% -86 for π/4-DQPSK (2Mbps) Sensitivity @ BER=0.
6252B-SR 6. Pin Definition 6.1 Pin Outline < TOP VIEW > 6.2 Pin Definition details NO.
6252B-SR 1 GND － Ground connections 2 ANT1 I/O 3 GND － Ground connections 4 GND － Ground connections 5 GND － Ground connections 6 GND － Ground connections 7 GND － Ground connections 8 GND － Ground connections 9 ANT0 I/O RF I/O port chain0, dual band Wi-Fi 10 GND － Ground connections 11 GND － Ground connections 12 NC or BT_TRX I/O 13 GND － RF I/O port chain1, dual band Wi-Fi and BT （for 2ant type) Reserved for BT RF I/O port, used only in 3 ANT version Ground
6252B-SR External Low Power Clock input (32.768KHz) 31 SUSCLK I 32 GND － Ground connections 33 NC － No connect 34 VDDIO P I/O Voltage supply input 1.8V or 3.3V 35 NC － No connect 36 VCC33 P Main power voltage source input 3.3V 37 NC － No connect If not used keep NC 1.8V or3.3V 3.
6252B-SR VCC33 3.15 3.3 3.45 V VDDIO (3.3V) - 3.3 3.6 V VDDIO (1.8V) 1.68 1.8 1.98 V 7.2 Interface Circuit time series 7.2.1 Power on sequence 7.2.2 SDIO Pin Description The module supports SDIO version 3.0 for all 1.8V 4-bit UHSI speeds: SDR50(100 Mbps), SDR104(208MHz) and DDR50(50MHz, dual rates) in addition to the 3.3V default speed(25MHz) and high speed (50 MHz). It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO pin.
6252B-SR interrupt signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force the control of the gated clocks from within the WLAN chip is also provided. SDIO Pin Description SD 4-Bit Mode DATA0 Data Line 0 DATA1 Data Line 1 or Interrupt DATA2 Data Line 2 or Read Wait DATA3 Data Line 3 CLK Clock CMD Command Line 7.2.
6252B-SR Outputs:CMD, DAT(referenced to CLK) Output delay time - Data Transfer mode tODLY 0 - 14 ns Output delay time - Identification mode tODLY 0 - 50 ns Typical Maximum Unit a. Timing is based on CL ≤ 40 pF load on CMD and Data. b. Min(Vih) = 0.7 × VDDIO and max(Vil) = 0.2 × VDDIO. 7.2.
6252B-SR Total system capacitance(each line) CL - a. Timing is based on CL ≤ 40 pF load on CMD and Data. b. Min(Vih) = 0.7 × VDDIO and max(Vil) = 0.2 × VDDIO. - 40 pF 7.2.5 SDIO Bus Timing Specifications in SDR Modes Clock timing (SDR Modes) Parametwer Symbol Minimum Maximum Unit Comments - tCLK 40 - ns SDR12 mode 20 - ns SDR25 mode 10 - ns SDR50 mode 4.8 - ns SDR104 mode - 0.2 × tCLK ns tCR, tCF < 2.00 ns (max)@100 MHz, - tCR, tCF CCARD = 10 pF tCR, tCF < 0.
6252B-SR Symbol Minimum Maximum Unit Comments SDR104 Mode tIS 1.70a - ns CCARD = 10pF, VCT = 0.975V tIH 0.80 - ns CCARD = 5pF, VCT = 0.975V tIS 3.00 - ns CCARD = 10pF, VCT = 0.975V tIH 0.80 - ns CCARD = 5pF, VCT = 0.975V SDR50 Mode a. SDIO 3.0 specification value is 1.40 ns.
6252B-SR tODLY - 7.85a ns tCLK≥10 ns CL=30 pF using driver type B for SDR50 tODLY - 14.0 ns tCLK≥20 ns CL=40 pF using for SDR12, SDR25 tOH 1.5 - ns Hold time at the tODLY(min) CL=15 pF a. SDIO 3.0 specification value is 7.5 ns. Card output timing (SDR Modes 100MHz to 208MHz) Symbol Minimum Maximum Unit Comments tOP 0 2 UI Card output phase △tOP -350 +1550 ps Delay variation due to temp change after tuning tODW 0.6 - UI tODW = 2.
6252B-SR 7.2.6 SDIO Bus Timing Specifications in DDR50 Mode parameter Symbol Minimum Maximum Unit Comments - tCLK 20 - ns DDR50 mode - tCR, tC - 0.2 ×tCLK ns tCR, tCF < 4.00 ns (max)@50 MHz, CCARD = 10 pF Clock duty - 45 55 % - Data Timing parameter Symbol Minimum Maximum Unit Comments Input setup time tISU 6 - ns CCARD < 10 pF (1 Card) Input hold time tIH 0.
6252B-SR Output delay time tODLY - 13.7 ns CCARD < 30 pF (1 Card) Output hold time tOH 1.5 - ns CCARD < 15 pF (1 Card) Input setup time tISU2x 3 - ns CCARD < 10 pF (1 Card) Input hold time tIH2x 0.8 - ns CCARD < 10 pF (1 Card) Output delay time tODLY2x - 7.85a ns CCARD < 25 pF (1 Card) Output hold time tODLY2x 1.5 - ns CCARD < 15 pF (1 Card) Input DAT Output CMD a. SDIO 3.0 specification value is 7.0 ns 8. Size reference 8.1 Module Picture L x W : 15 x 13 (+0.3/-0.
6252B-SR 8.2 Marking Description NA 8.
6252B-SR 8.4 Layout Recommendation 6,5 7,5 0,2 0,7 7,75 7,5 6,625 6,1 5,6 5,2 4,7 4,3 3,8 3,4 2,9 2,5 2 1,6 1,1 0,65 0,25 6,75 6,5 5,625 4,75 4,25 3,85 3,35 2,95 2,45 2,05 1,55 1,15 9. The Key Material List Chipset RTL8852BS Realtek PCB FR4, 4 LAYER, GREEN XY-PCB, GDKX, Sunlord, SLPCB Crystal 2016 40MHz ±10ppm ECEC, TKD, Hosonic, JWT, TXC Inductor 2016 1.0uH,±20% Sunlord, Ceaiya, Cenker Inductor 0603 2.2UH,±10% Sunlord, Ceaiya, Cenker Diplexer 1608 Dual-band, dual-mode 2.
6252B-SR 10.
6252B-SR 11. Recommended Reflow Profile Referred to IPC/JEDEC standard.
6252B-SR 12. Package 12.1 Reel A roll of 1500pcs 12.
6252B-SR 12.3 Packaging Detail the take-up package 13. Moisture sensitivity The Modules is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).
6252B-SR d) Baking is required if conditions b) or c) are not respected e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more 14.Label WIFI+BT Module Model No: 6252B-SR FCC ID: 2AATL-6252B-SR Rating: DC3.
FCC Statements: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
A user's manual for the finished product should include one of the following statements:For a Class A digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
General Statements The module is limited to OEM installation only. The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. This module should be installed and operated with a minimum distance 20cm between the radiator and your body. OEM integrator shall equipped the antenna to compliance with antenna requirement part 15.203& 15.204 and must not be co-located or operating in conjunction with any other antenna or transmitters.
