Specifications

COMPANY CONFIDENTIAL
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Remark:
a. 2.4mm maximum above mother board
b. Cut area of main board under M.2 module
c. Need to add thermal pad between M.2 modules with mechanical component (like
material shielding) for thermal dissipation.
3.3.2 Top-mount Connection with Single Sided Module
Figure 3-4 shows Top Mount Single-sided Module for 1.5 Maximum Component Height; refer
to section 2.4.7.3.1 of PCIe M.2_Rev 1.1 standard.